IC Package Support Structure for Offset Die Overhang
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Solution Overview
Problem
The IC packaging industry faces challenges in protecting fragile components during wire-bonding, particularly with the risk of cracking and inefficient use of space, which affects cost, efficiency, and performance in densely packed wireless products.
Innovation Solution
The solution involves a substrate with a support structure that mounts integrated circuit dies and wire-bonded dies in an offset configuration, connected by bond wires, and encapsulated to prevent cracking and optimize space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If wire-bonded die is mounted offset above integrated circuit die to reduce package footprint, then space utilization is improved, but the wire-bonded die becomes fragile and prone to cracking during wire-bonding
Solution Approach 1:
A support structure is introduced as an intermediary element between the substrate and the wire-bonded die. This support structure provides mechanical reinforcement to the wire-bonded die during the wire-bonding process, preventing cracking while enabling the offset mounting configuration that reduces package footprint.
Solution Approach 2:
The support structure is pre-positioned beneath the wire-bonded die before the wire-bonding process begins. This beforehand cushioning provides protective support during the critical wire-bonding operation, preventing damage that would otherwise occur due to the fragile offset-mounted configuration.
2Productivity
If multiple ICs are densely packed to increase functionality in less space, then productivity and functionality are improved, but the components become more fragile and difficult to assemble
Solution Approach 1:
The support structure acts as a mediator that enables the assembly of fragile wire-bonded die in dense configurations. By providing mechanical support during wire-bonding, it makes the manufacturing process feasible despite the increased fragility inherent in high-density packaging.
3Area of stationary object
If wire-bonding is performed on offset-mounted die to achieve compact packaging, then space efficiency is improved, but the risk of cracking increases
Solution Approach 1:
The support structure converts the potential harm of cracking into a beneficial situation by providing mechanical reinforcement. The offset mounting that would normally create vulnerability is transformed into an acceptable configuration because the support structure compensates for the increased stress and prevents cracking during wire-bonding.
Data Source
AI summary
An integrated circuit package system including: providing a substrate having a support mounted thereover; mounting an integrated circuit die above the substrate; mounting a wire-bonded die offset above the integrated circuit die creating an overhang supported by the support; connecting the wire-bonded die to the substrate with bond wires; and encapsulating the integrated circuit die, the wire-bonded die and the bond wires with an encapsulation.