IC Package Support Structure Under Wire-In-Film Adhesive
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current electronics packaging technologies face challenges in accommodating high-speed devices, particularly in terms of cooling, reliability, and cost-effectiveness, with increasing complexity and risk of errors during manufacture, while struggling to meet the demands of smaller footprints and more robust packages.
Innovation Solution
The implementation of an integrated circuit package system that includes a substrate with a wire bonded die, connected by bond wires, and a structure mounted over the die using a wire-in-film adhesive with support structures at the overhangs, encapsulated with a thermally conductive dielectric material that reduces wire bonding bouncing and allows for stable bonding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire-in-film adhesive is used to mount structure over wire bonded die, then bonding stability is improved, but wire bonding bouncing and errors increase
Solution Approach 1:
A support structure is introduced as an intermediary element between the wire bonded die and the structure mounted above it. This support structure provides mechanical stability and reduces wire bonding bouncing by distributing stresses, thereby maintaining bonding accuracy while enabling stable mounting of the upper structure using wire-in-film adhesive
Solution Approach 2:
The mounting system is divided into separate functional components: the wire bonded die, the support structure, and the upper structure. This segmentation allows each component to perform its specific function optimally - the support structure handles mechanical stability while the wire-in-film adhesive handles the upper mounting, reducing interference between functions
2Area of stationary object
If package size is reduced to meet portable electronics requirements, then footprint is improved, but manufacturing complexity and error risk increase
Solution Approach 1:
The patent transitions from a planar two-dimensional layout to a three-dimensional stacked configuration. Multiple components (substrate, wire bonded die, support structure, and upper structure) are arranged vertically, allowing high-density integration in a small footprint while maintaining manufacturing simplicity through standardized vertical assembly processes
3Reliability
If support structures are added to reduce wire bonding bouncing, then bonding reliability is improved, but package complexity increases
Solution Approach 1:
The support structure serves multiple functions simultaneously: it provides mechanical support to reduce wire bonding bouncing, acts as a mounting platform for the upper structure, and facilitates thermal management. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in package complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability and efficiency of the packaging process by reducing wire bonding errors, enabling stable bonding of larger dies on smaller substrates, and maintaining a reduced package size while ensuring thermal conductivity and cost-effectiveness.
Implementation Method 1
having a wire-in-film adhesive between the structure and the wire bonded die
Implementation Method 2
encapsulated with a thermally conductive dielectric material
Data Source
AI summary
An integrated circuit package in package system including: providing a substrate; mounting a wire bonded die with an active side over the substrate; connecting the active side to the substrate with bond wires; mounting a structure over the wire bonded die having a wire-in-film adhesive between the structure and the wire bonded die and overhangs at ends of the structure between the wire-in-film adhesive and the substrate; mounting support structures at the overhangs between the wire-in-film adhesive and the substrate; and encapsulating the wire bonded die and the structure with an encapsulation.