IC Package Support Substrate for Uniform Heat Spreader Contact
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in creating smaller and more efficient packaging techniques for semiconductor dies due to the need for improved heat dissipation and integration density, particularly in achieving uniform thickness for thermal solutions across varying memory device thicknesses.
Innovation Solution
The implementation of a support substrate of any thickness over integrated circuit devices, allowing for a more even surface to attach heat spreaders and improve heat dissipation efficiency, while accommodating different memory device thicknesses through hybrid bonding and conductive connectors for thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If memory device thickness is reduced to improve integration density, then more devices can be integrated into a given area, but heat dissipation becomes more difficult due to varying thicknesses
Solution Approach 1:
A support substrate is introduced as an intermediary component between the memory devices and the heat spreader. This support substrate provides a uniform mounting surface that enables consistent thermal contact, allowing heat to be efficiently dissipated from devices of varying thicknesses without compromising integration density.
2Temperature
If heat spreaders are attached directly to memory devices of varying thicknesses, then thermal management can be implemented, but the surface uniformity required for effective heat dissipation cannot be achieved
Solution Approach 1:
The support substrate serves as a mediator that creates a planar, uniform surface for heat spreader attachment. This intermediate layer compensates for thickness variations in the memory devices, ensuring consistent thermal contact and effective heat dissipation across the entire device array.
Solution Approach 2:
The solution moves from directly managing thermal issues in the vertical dimension (device thickness) to introducing a new dimensional layer (the support substrate plane) that provides uniformity. By adding this intermediate plane, the system achieves surface uniformity without altering the underlying device thickness variations.
Data Source
AI summary
A semiconductor package includes a redistribution structure, a first device and a second device attached to the redistribution structure, the first device including: a first die, a support substrate bonded to a first surface of the first die, and a second die bonded to a second surface of the first die opposite the first surface, where a total height of the first die and the second die is less than a first height of the second device, and where a top surface of the substrate is at least as high as a top surface of the second device, and an encapsulant over the redistribution structure and surrounding the first device and the second device.