Integrated Circuit Package for Precious Material Tamper Verification
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Solution Overview
Problem
Current systems lack efficient methods to verify and securely store precious materials like gold within integrated circuit packages, particularly in contexts where trust and authenticity are crucial for financial transactions, and tampering detection is essential.
Innovation Solution
An integrated circuit package (ICP) with embedded precious materials and a tamper detection device, where the precious material reservoir is embedded within substrate layers, and the ICP includes data storage for the material's mass at manufacture, along with sensors and encryption services for secure transaction verification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If precious materials are embedded in integrated circuit packages for financial transactions, then the monetary value and trustworthiness of the package increases, but the vulnerability to tampering and the complexity of verification increase
Solution Approach 1:
The patent applies preliminary action by pre-embedding tamper detection devices and data storage elements during manufacturing, before the package is put into service. The tamper detection device is pre-configured with baseline characteristics of the precious material, and the data storage element is pre-loaded with authenticity data, enabling immediate verification without complex external systems.
Solution Approach 2:
The patent uses an intermediary approach by introducing a data storage element that stores authenticity data about the precious material. This intermediary component mediates between the precious material and the verification system, providing a simplified interface for authentication without requiring direct complex analysis of the precious material itself.
2Reliability
If tamper detection devices are integrated into the package, then the ability to detect tampering improves, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges multiple functions into a single integrated structure. The tamper detection device is combined with the precious material reservoir and substrate layers into a unified package, eliminating the need for separate external detection systems. The data storage element is also integrated within the package structure, reducing the number of discrete components and simplifying manufacturing.
Solution Approach 2:
The substrate layers serve multiple functions: they provide structural support, embed the precious material reservoir, house the tamper detection device, and contain the data storage element. This multi-functionality reduces the number of separate components needed and simplifies the manufacturing process by using a single platform for multiple purposes.
3Reliability
If the physical integrity of the package is compromised, then tampering is detected, but the value of the precious material may be lost or devalued
Solution Approach 1:
The patent applies preliminary anti-action by pre-configuring the tamper detection device to detect and respond to potential tampering attempts before they can result in loss of precious material. The device monitors the physical integrity of the package and can trigger alerts or disable functions before actual theft or damage occurs, preventing the loss rather than just detecting it after the fact.
Data Source
AI summary
Integrated circuit package (ICP) with: (i) stored information pertaining to an amount and/or value of precious material present in the ICP; and (ii) sensor for detecting an amount of precious material present in the ICP. In some embodiments the ICP is embedded in a smart card for use with a smart card reader system that can communicate data to and/or from the ICP.