IC Package Thermal Brace for High TIM Pressure Without Wafer Damage
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving high thermal interface material (TIM) pressure for effective thermal management in high-power systems, which is essential for reducing thermal resistance, while also preventing damage to integrated fan-out wafers during drilling and screwing processes, and integrating thermal management systems within server chassis efficiently.
Innovation Solution
The use of a mechanical brace with compression parts to apply enhanced pressure to thermal interface materials in thermal management systems, which includes a rigid body with fasteners that securely engage thermal modules, ensuring high pressure (>30 psi) is applied to TIMs, thereby preventing wafer damage and integrating thermal management within server chassis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stress or pressure
If traditional drilling and screwing processes are used to secure thermal modules, then thermal interface material pressure can be achieved, but wafer damage occurs during the process
Solution Approach 1:
The patent introduces a mechanical brace as an intermediary component that applies pressure to the thermal interface material without requiring direct drilling and screwing of the wafer. The brace transfers the loading force from the thermal module through the TIM to the substrate, eliminating the need for fasteners that would penetrate and damage the wafer structure.
Solution Approach 2:
The mechanical brace is designed as a separate component that segments the pressure application function from the wafer structure. Instead of integrating fasteners into the wafer (which causes damage), the brace provides a独立的 pressure application mechanism that contacts the thermal module and TIM without penetrating the wafer.
2Temperature
If high pressure is applied to thermal interface material for effective thermal management, then thermal resistance is reduced, but wafer damage occurs during drilling and screwing
Solution Approach 1:
The mechanical brace serves as a mediator that achieves the necessary pressure for thermal management without the harmful drilling and screwing processes. It transfers force through the TIM to achieve low thermal resistance while preserving wafer integrity by avoiding penetrating fasteners.
3Temperature
If mechanical brace with compression parts is used to apply enhanced pressure to TIM, then thermal management is improved, but device complexity increases
Solution Approach 1:
The mechanical brace performs multiple functions: it applies pressure to the TIM for thermal management, provides mechanical support for the thermal module, and eliminates the need for separate fastening components. This multi-functionality reduces overall device complexity despite adding the brace component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances TIM pressure for improved thermal management, increases package reliability after thermal cycling, and reduces the cost and size of overall systems by preventing wafer damage during processing and integrating thermal management within server chassis.
Implementation Method 1
a mechanical brace with compression parts to apply enhanced pressure to thermal interface materials in thermal management systems
Implementation Method 2
a rigid body with fasteners that securely engage thermal modules, ensuring high pressure (>30 psi) is applied to TIMs
Data Source
AI summary
An embodiment includes a first package component including a first integrated circuit die and a first encapsulant at least partially surrounding the first integrated circuit die. The device also includes a redistribution structure on the first encapsulant and coupled to the first integrated circuit die. The device also includes a first thermal module coupled to the first integrated circuit die. The device also includes a second package component bonded to the first package component, the second package component including a power module attached to the first package component, the power module including active devices. The device also includes a second thermal module coupled to the power module. The device also includes a mechanical brace extending from a top surface of the second thermal module to a bottom surface of the first thermal module, the mechanical brace physically contacting the first thermal module and the second thermal module.