IC Package Support Substrate for Uniform Thermal Interface

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Solution Overview

Problem

The semiconductor industry faces challenges in creating smaller and more efficient packaging techniques for semiconductor dies due to the need for improved heat dissipation and integration density, particularly in achieving uniform thickness for thermal solutions and accommodating varying memory device thicknesses.

Innovation Solution

The development of an integrated circuit package that includes a support substrate over logic and memory devices, allowing for a uniform surface for thermal solutions and accommodating different memory device thicknesses by using a support substrate that can be of any thickness, which also functions as a heat spreader to enhance heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If memory devices of different thicknesses are integrated onto a support substrate, then integration density and versatility are improved, but manufacturing precision and uniformity are worsened

Engineering Contradiction:

Improveaccommodation of varying memory device thicknessesVSAvoiduniform thickness for thermal solutions

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent applies local quality by allowing different regions of the support substrate to accommodate memory devices of varying thicknesses. The support substrate is designed with a first region for logic devices and a second region for memory devices, where the second region can accommodate memory devices of different thicknesses while maintaining overall structural integrity and uniform thermal performance across the package.

Inventive Principle:

Principle #3Local quality

2Adaptability or versatility

If the support substrate is made thicker to accommodate varying memory device thicknesses, then adaptability is improved, but the total package size increases

Engineering Contradiction:

Improveaccommodation of varying memory device thicknessesVSAvoidtotal package thickness

Core Design Contradiction:

Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

The patent resolves the thickness contradiction by transitioning to three-dimensional stacking architecture. Multiple logic device stacks and memory device stacks are arranged in vertical layers above the support substrate, allowing the package to accommodate varying memory device thicknesses through vertical dimensionality rather than increasing the horizontal substrate thickness. This enables compact packaging while maintaining adaptability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If conventional packaging techniques are used, then manufacturing simplicity is maintained, but heat dissipation efficiency deteriorates

Engineering Contradiction:

Improvepackaging process simplicityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Ease of manufactureVSLoss of energy

Solution Approach 1:

The support substrate is designed with multi-functionality, serving simultaneously as a mechanical support structure, a thermal management component, and an electrical interconnection platform. The substrate includes integrated heat dissipation features such as thermal vias and heat spreader structures that work together with the stacked devices to improve heat dissipation efficiency while maintaining ease of manufacture through a unified packaging process.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves heat dissipation efficiency and reliability by providing a uniform surface for thermal solutions and accommodating various memory device thicknesses, enabling more efficient packaging of semiconductor dies.

Implementation Method 1

a support substrate over the logic device and the memory device, wherein the support substrate functions as a heat spreader to enhance heat dissipation

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS20240021554A1Integrated circuit package and method of forming thereof

Publication Date: 2024.01.18 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor package includes a redistribution structure, a first device and a second device attached to the redistribution structure, the first device including: a first die, a support substrate bonded to a first surface of the first die, and a second die bonded to a second surface of the first die opposite the first surface, where a total height of the first die and the second die is less than a first height of the second device, and where a top surface of the substrate is at least as high as a top surface of the second device, and an encapsulant over the redistribution structure and surrounding the first device and the second device.