IC Package Thermal Isolation for Heat-Sensitive Components

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Solution Overview

Problem

The challenge lies in effectively managing thermal cross-talk between heat-generating and temperature-sensitive components in electronic devices, particularly in compact designs like RF communication devices, where heat transfer can degrade the performance of sensitive components like acoustic wave resonators.

Innovation Solution

The proposed solution involves thermal management structures within integrated circuit (IC) packages that include a heat-generating component and a temperature-sensitive component in a single package, utilizing a high thermal conductivity material and a heat spreader to isolate the temperature-sensitive component from heat sources, while using a mold compound and underfill materials to provide mechanical support and thermal insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If heat-generating and temperature-sensitive components are placed close together in a single package, then device integration and compactness are improved, but thermal cross-talk increases causing temperature fluctuations in sensitive components

Engineering Contradiction:

Improvepackage sizeVSAvoidtemperature stability of sensitive component

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The package is segmented into distinct thermal zones using thermal isolation structures. The temperature-sensitive component is isolated from the heat-generating component through thermal isolation layers and structures, creating separate thermal management zones within the single package. This allows close physical integration while maintaining thermal independence between components.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Thermal isolation structures act as intermediary elements between the heat-generating component and the temperature-sensitive component. These intermediary thermal management structures block or redirect heat flow, preventing direct thermal coupling while allowing the components to coexist in close proximity within the same package.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If separate packaging is used for heat-generating and temperature-sensitive components, then thermal isolation is improved, but device size and complexity increase

Engineering Contradiction:

Improvetemperature isolation between componentsVSAvoidpackage structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

Multiple functional elements are merged into a single integrated package structure. The heat-generating component, temperature-sensitive component, and thermal management structures are combined in one package, achieving both thermal isolation and compact integration. This unified approach reduces the number of separate packages and interconnections needed.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The package substrate and thermal management structures serve multiple functions simultaneously: mechanical support, electrical interconnection, and thermal management. This multi-functionality reduces the need for additional dedicated thermal isolation components, simplifying the overall device structure while maintaining effective thermal separation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If thermal management structures are added to isolate components, then temperature control is improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:

Improvetemperature control of sensitive componentVSAvoidmanufacturing complexity of thermal management structures

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The thermal management approach utilizes parameter changes in material properties, specifically varying thermal conductivity across different layers and regions. By selecting materials with appropriate thermal conductivity parameters for different zones, effective thermal isolation is achieved through material selection rather than complex structural designs, simplifying manufacturing.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables closer integration of heat-generating and temperature-sensitive components, maintaining the performance of sensitive components within acceptable temperature ranges, allowing for smaller form factors and enabling the integration of next-generation electronic devices without compromising their performance.

Implementation Method 1

utilizing a high thermal conductivity material and a heat spreader to isolate the temperature-sensitive component from heat sources

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

using a mold compound and underfill materials to provide mechanical support and thermal insulation

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS11830787B2Thermal management in integrated circuit packages

Publication Date: 2023.11.28 INTEL CORP

AI summary

Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.