IC Package Thermal Path Layout Using Cover-Coupled Metal Regions
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Solution Overview
Problem
Existing integrated circuit packages, such as BGA packages, face challenges in efficiently dissipating heat generated by electronic chips, as thermal dissipation paths are not always sufficient.
Innovation Solution
The electronic device design includes metal regions thermally coupling contact pads of the chip to a metallic cover, with an electrically insulating thermally-conductive layer in contact with both the chip and the cover, and connection balls on the interconnection substrate, enhancing thermal dissipation by creating additional thermal paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional BGA package structure is used, then electrical integration is achieved, but thermal dissipation is insufficient
Solution Approach 1:
The patent divides the thermal management system into multiple independent thermal paths: (1) metal regions on the interconnection substrate providing thermal coupling between contact pads and cover, (2) thermally-conductive adhesive layers providing additional thermal paths, and (3) the metallic cover itself acting as a heat sink. This segmentation creates redundant thermal dissipation routes, improving heat management reliability without compromising electrical integration.
Solution Approach 2:
The metallic cover serves multiple functions simultaneously: (1) as a mechanical protective enclosure, (2) as an electrical ground reference, and (3) as a thermal heat sink. The interconnection substrate also performs dual roles of electrical connection and thermal conduction. This multi-functionality improves thermal dissipation while maintaining electrical integration capabilities.
2Temperature
If metal regions are added for thermal coupling, then thermal paths are improved, but device complexity increases
Solution Approach 1:
The patent merges thermal management functions with existing structural components. The interconnection substrate's metal layers are repurposed to provide both electrical connections and thermal coupling paths. The metallic cover serves as both mechanical enclosure and heat sink. The adhesive layers simultaneously provide mechanical bonding and thermal conduction. This merging approach improves thermal coupling without proportionally increasing device complexity.
Solution Approach 2:
Existing components in the package structure are made to serve thermal management functions without requiring separate dedicated thermal components. The interconnection substrate's metal traces and layers self-serve as thermal pathways, the adhesive layers self-serve as thermal interfaces, and the cover self-acts as a heat sink. This self-service approach improves thermal paths while avoiding additional complexity from separate thermal management components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation by creating effective thermal paths between the chip, the cover, and the external device, allowing for better management of heat generated by the electronic chip.
Implementation Method 1
at least one metal region thermally couples at least one contact pad of the chip to the cover
Implementation Method 2
an electrically insulating thermally-conductive layer in contact with both the chip and the cover
Data Source
AI summary
An electronic device includes an electronic chip located between a cover and an interconnection substrate. The electronic chip has contact pads located in front of a first surface of the interconnection substrate. At least one metal region (for example extending on the front surface) thermally couples at least one contact pad of the electronic chip to the cover.