IC Package Thermal Zoning for Sensitive Component Isolation
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Solution Overview
Problem
The integration of heat-generating and temperature-sensitive components in electronic devices poses thermal management challenges, particularly in compact designs where thermal cross-talk can degrade the performance of sensitive components like acoustic wave resonators in RF devices.
Innovation Solution
The proposed thermal management structures and assemblies enable the closer integration of heat-generating and temperature-sensitive components within a single IC package using a substrate with a high thermal conductivity material, a heat spreader, and underfill materials to isolate the sensitive components from heat sources, while also incorporating cooling devices like thermoelectric coolers and vapor chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If heat-generating and temperature-sensitive components are integrated closer together in a single IC package, then device form factor is reduced and integration is improved, but thermal cross-talk increases and performance of sensitive components degrades
Solution Approach 1:
The IC package is segmented into distinct thermal zones using substrates with laterally varying thermal conductivity. Different regions of the substrate have different thermal conductivity values, creating thermal isolation between heat-generating components and temperature-sensitive components while maintaining their physical integration within the same package.
Solution Approach 2:
The substrate exhibits local quality variations in thermal conductivity across its surface. By configuring different regions with different thermal conductivity properties, the substrate provides tailored thermal management for different component locations, allowing heat to be conducted away from heat-generating areas while insulating sensitive areas.
2Object-affected harmful factors
If conventional thermal management approaches are used with separately packaged components, then thermal isolation is improved, but device size increases and integration is reduced
Solution Approach 1:
Multiple components with different thermal requirements are merged into a single IC package. The substrate is designed to accommodate both heat-generating components and temperature-sensitive components in the same package, using spatially varying thermal conductivity to provide thermal isolation without requiring separate packages.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support for all components, electrical interconnection between components, and differentiated thermal management for different component types. The laterally varying thermal conductivity enables the substrate to perform both thermal conduction and thermal insulation functions in different regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for compact integration of components without compromising the performance of temperature-sensitive elements, enabling smaller form factors and improved thermal management in electronic devices, such as next-generation 5G wireless communication devices.
Implementation Method 1
a substrate with a high thermal conductivity material
Implementation Method 2
a heat spreader
Implementation Method 3
cooling devices like thermoelectric coolers
Implementation Method 4
vapor chambers
Data Source
AI summary
Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.