IC Package Thermal Management via Substrate Through-Holes
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Solution Overview
Problem
Conventional integrated circuit (IC) packages suffer from inadequate heat dissipation due to the use of non-efficient materials like resin and package substrates, leading to reduced operating lifespan and abnormal functioning of semiconductor chips.
Innovation Solution
The integration of a substrate with a first and second heat dissipation layer, where the second heat dissipation layer extends into a chamber formed between the semiconductor chip and the substrate, allowing for effective heat dissipation by connecting with the first heat dissipation layer, thereby enhancing thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional packaging materials (resin and package substrate) are used, then the packaging structure is simple and easy to manufacture, but heat dissipation efficiency is poor leading to localized heat and reduced chip lifespan
Solution Approach 1:
The packaging structure is segmented into multiple functional layers: a package substrate, a heat dissipation layer with through-holes, and a resin layer. This segmentation allows each layer to perform its specific function optimally - the substrate provides electrical connection, the heat dissipation layer removes heat through conduction and convection via through-holes, and the resin provides protection and insulation.
Solution Approach 2:
The invention uses composite material structures combining different materials with complementary properties. The heat dissipation layer is formed by a composite of conductive materials filling through-holes in the package substrate, creating a multi-material system that combines electrical conductivity, thermal conductivity, and mechanical support functions.
2Temperature
If heat dissipation layers are added to improve thermal management, then heat dissipation efficiency improves, but manufacturing process complexity increases
Solution Approach 1:
The through-holes are pre-formed in the package substrate before final assembly, and the heat dissipation material is pre-filled into these holes. This preliminary preparation of the heat dissipation pathway simplifies the overall manufacturing process by breaking down complex steps into manageable sequential operations rather than attempting to form the complete heat dissipation structure in a single difficult step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat dissipation efficiency, extending the operational lifespan of semiconductor chips and preventing abnormal functioning by effectively transferring heat away from the chip.
Implementation Method 1
A first heat dissipation layer is disposed in the first hole, and extends into the chamber
Implementation Method 2
A second heat dissipation layer is formed in the first hole, and extends into the chamber, wherein the second heat dissipation layer is contacted to the first heat dissipation layer
Data Source
AI summary
The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.