IC Package With Embedded Transducer Eliminates Connector Impedance
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Solution Overview
Problem
Conventional connector architectures in electronic systems introduce impedance discontinuities, degrading signal quality and integrity, especially in high-speed data transfer applications, and are prone to mechanical issues like wear and alignment requirements.
Innovation Solution
The integration of electromagnetic transducers within IC packages, embedded in insulating material, with an electromagnetic-energy directing assembly to facilitate wireless communication between ICs, reducing mechanical interference and enhancing signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional mechanical connectors are used to connect PCBs, then electrical connection between boards is established, but impedance discontinuities occur degrading signal quality
Solution Approach 1:
The patent replaces mechanical connectors with electromagnetic field-based wireless communication. Transducers convert electrical signals to electromagnetic signals that propagate through insulation material between ICs, eliminating mechanical contact points that cause impedance discontinuities and signal degradation.
Solution Approach 2:
The invention extracts and removes the mechanical connector component from the system entirely. By eliminating the physical connector interface between PCBs, the source of impedance discontinuities, wear, and alignment requirements is removed, allowing direct electromagnetic coupling between ICs.
2Reliability
If mechanical connectors are used for data transfer, then connection between PCBs is achieved, but mechanical wear and alignment requirements increase
Solution Approach 1:
The patent substitutes mechanical connection systems with electromagnetic field-based communication. Transducers generate and detect electromagnetic signals that pass through insulation material, eliminating the need for precise mechanical alignment and avoiding wear associated with sliding contacts.
Solution Approach 2:
The insulation material serves as an intermediary medium that allows electromagnetic signals to pass between ICs on different PCBs. This intermediary enables communication without direct mechanical contact, eliminating alignment requirements while maintaining signal transmission.
3Productivity
If conventional connectors are used, then board-to-board communication is enabled, but costly electronics are required to negotiate discontinuities
Solution Approach 1:
The patent replaces mechanical and electronic discontinuity negotiation systems with direct electromagnetic coupling. By maintaining consistent impedance pathways through the insulation material and using transducers for signal conversion, the need for expensive electronics to compensate for connector-induced discontinuities is eliminated.
Solution Approach 2:
The invention merges the functions of connection establishment and signal transmission into a unified electromagnetic field-based system. The transducer and insulation material work together to provide both physical connection and signal pathway, eliminating the need for separate discontinuity negotiation electronics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves signal integrity and stability by eliminating mechanical discontinuities, enabling reliable high-speed data transfer and reducing the need for precise alignment and costly electronics.
Implementation Method 1
a first transducer configured to convert electromagnetic signals into electrical signals
Implementation Method 2
insulating material in which the IC and transducer are at least partly embedded
Implementation Method 3
an electromagnetic-energy directing assembly mounted relative to the transducer for directing electromagnetic energy in a region including the transducer and in a direction away from the IC
Data Source
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AI summary
A system for transmitting or receiving signals may include an integrated circuit (IC), a transducer operatively coupled to the IC for converting between electrical signals and electromagnetic signals; and insulating material that fixes the locations of the transducer and IC in spaced relationship relative to each other. The system may further include a lead frame providing external connections to conductors on the IC. An electromagnetic-energy directing assembly may be mounted relative to the transducer for directing electromagnetic energy in a region including the transducer and in a direction away from the IC. The directing assembly may include the lead frame, a printed circuit board ground plane, or external conductive elements spaced from the transducer. In a receiver, a signal-detector circuit may be responsive to a monitor signal representative of a received first radio-frequency electrical signal for generating a control signal that enables or disables an output from the receiver.