Integrated Circuit Package Voltage Regulation
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Solution Overview
Problem
Integrated circuits (ICs) face voltage droop issues due to sudden current transients, which existing external voltage regulators struggle to manage effectively, often requiring bypass capacitors that only partially mitigate the problem and add to package ringing.
Innovation Solution
Incorporating a voltage regulator IC die within the IC package, coupled to the IC die using the top-most conductive layers, minimizes series inductance and eliminates the need for external bypass capacitors by providing internal voltage regulation, thereby reducing voltage droop and package ringing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an external voltage regulator is used on the PCB, then voltage regulation is provided for the IC, but voltage droop occurs during current transients
Solution Approach 1:
The voltage regulator functionality is merged with the IC package by integrating a voltage regulator die within the package substrate. This integration allows the voltage regulator to be physically closer to the IC, reducing the loop area and series inductance between the regulator and IC power pins, thereby minimizing voltage droop during current transients while maintaining effective voltage regulation
Solution Approach 2:
The package substrate serves as an intermediary between the external PCB voltage regulator and the IC. By placing a voltage regulator die on the package substrate and coupling it to the IC through conductive layers, the substrate acts as a mediator that reduces the electrical distance and inductance, effectively transferring regulated power to the IC with minimal voltage droop
2Object-affected harmful factors
If bypass capacitors are added to the PCB, then voltage droop is slightly reduced, but package ringing increases
Solution Approach 1:
The need for external bypass capacitors is eliminated by extracting the voltage regulation function from the PCB level and integrating it directly into the IC package. The integrated voltage regulator die with its low-inductance connection to the IC inherently provides the decoupling function that bypass capacitors attempt to achieve, removing the source of package ringing while still mitigating voltage droop
3Area of moving object
If the IC die size is reduced, then more ICs can be mounted on the PCB, but the ability to handle current transients worsens
Solution Approach 1:
By merging the voltage regulator die with the IC die within the same package, smaller IC dies can be used on the PCB while each IC still has dedicated voltage regulation capability integrated with it. This ensures that even small IC dies can handle current transients effectively without relying on distant external regulators or large PCB-mounted capacitors
Data Source
AI summary
In an example, an IC package includes a package substrate including a plurality of bumps configured for coupling to a printed circuit board, the package substrate including a core disposed between a plurality of top-side conductive layers and a plurality of bottom-side conductive layers. The IC package further includes an IC die coupled to the package substrate and disposed on top of the plurality of top-side conductive layers. The IC die further includes a voltage regulator IC die disposed on the package substrate adjacent to the IC die, the voltage regulator IC die being coupled to the IC die using two of four top-most layers of the plurality of top-side conductive layers nearest the IC die.