IC Package Cavity Wall Trenches for Clean Glue-Free Cutting
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Solution Overview
Problem
The existing methods for manufacturing integrated circuit packages face issues with glue spilling into cutting areas during the cutting process, leading to defects such as burrs and weakened sealing structures due to the elasticity of the glue, which results in non-compact packages.
Innovation Solution
The method involves forming first trenches around each cavity to create a 'U'-like shape in the wall, using a glue with a contact angle greater than 30° to prevent spillage, and forming second trenches that are thinner than the first trenches to ensure clean cuts without peeling off the glue, allowing for compact package production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the wall is made thin to enable bringing package locations close together, then productivity is improved, but glue spills into cutting areas causing defects
Solution Approach 1:
The method forms first trenches around each cavity before attaching the sealing structures. This preliminary action creates a geometric constraint that prevents glue from spreading into the cutting areas during the subsequent sealing step, thereby enabling thin walls without compromising cutting quality.
Solution Approach 2:
The cutting process is divided into two distinct steps: first trenches are formed around each cavity to contain the glue, and then second trenches are formed to perform the actual cutting. This segmentation allows the wall to be thin while preventing glue spillage during sealing.
2Manufacturing precision
If the wall is made wider to prevent glue spillage, then manufacturing precision is improved, but package compactness deteriorates
Solution Approach 1:
The first trenches are formed around each cavity before the sealing structures are attached. This preliminary geometric constraint allows the use of thin walls without risking glue spillage, thereby maintaining package compactness while ensuring cutting quality.
3Strength
If glue is used with elastic properties to ensure bonding, then strength is improved, but harmful factors increase due to peel-off during cutting
Solution Approach 1:
The first trenches are formed around each cavity before the sealing structures and glue are applied. This preliminary action creates a physical barrier that prevents the elastic glue from peeling off during the cutting process, thereby maintaining bonding strength without generating harmful defects.
Solution Approach 2:
The cutting process is segmented into two steps: first trenches are formed to contain the glue, then second trenches perform the actual cutting. This segmentation prevents the elastic glue from peeling off during cutting while maintaining bonding strength.
4Strength
If crosslinking step is performed before cutting to bond sealing structure, then strength is improved, but harmful factors increase due to glue elasticity during cutting
Solution Approach 1:
The first trenches are formed around each cavity before the sealing structures are attached and crosslinked. This preliminary geometric constraint prevents the crosslinked, elastic glue from peeling off during the subsequent cutting operation, thereby maintaining chemical bonding strength without generating harmful defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents glue from spilling into cutting areas and ensures defect-free cuts, resulting in compact integrated circuit packages without traces of peeled-off glue, thereby maintaining the integrity of the sealing structures.
Implementation Method 1
sealing the cavities by gluing respective sealing structures over an upper face of the wall between the first trenches using a glue
Data Source
AI summary
An integrated circuit package includes a support substrate having a mounting face and a lateral wall having an inner face and an outer face. The inner face delimits with the mounting face a cavity. The outer face includes a step extending outwardly of the package. An electronic chip disposed in the cavity and electrically connected to electrically-conductive contact pads. A sealing structure is bonded by a glue to an upper face of the lateral wall to seal the cavity. The glue does not spill out over the outer face of the lateral wall. Electrically-conductive connection elements are located over a lower face of the support substrate and electrically cooperate with the contact pads through an interconnection network located in the support substrate.