IC Package Warpage Control Structure for Underfill Delamination
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Solution Overview
Problem
The challenge in semiconductor packaging is to address the issue of warpage and delamination in integrated circuit packages, particularly in chip-on-wafer-on-substrate (CoWoS) configurations, due to stress accumulation in die-to-die underfill portions, which can lead to structural integrity issues.
Innovation Solution
A warpage control structure is implemented, comprising a front-side and backside warpage control structure, where the front-side structure has disconnected portions with gaps wider than the die-to-die underfill portion, and the backside structure overlaps with the underfill portion edges, reducing stress and preventing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If die-to-die underfill is used to bond integrated circuit dies, then bonding strength is improved, but stress accumulation occurs leading to warpage and delamination
Solution Approach 1:
The warpage control structure is divided into multiple disconnected portions separated by gaps, allowing stress to be distributed and relieved at the gap locations while maintaining overall structural support. This segmentation prevents continuous stress accumulation that would otherwise lead to delamination.
Solution Approach 2:
The warpage control structure is positioned specifically at regions where stress accumulation is most problematic, with gaps strategically located to provide stress relief. The structure has different properties in different regions - solid portions for support and gap regions for stress relief - addressing the local quality principle.
2Stability of the object's composition
If continuous warpage control structure is implemented, then warpage control is improved, but stress relief is reduced leading to delamination
Solution Approach 1:
The warpage control structure is intentionally segmented into disconnected portions with gaps between them. This segmentation allows the structure to maintain warpage control through its overall geometry while providing stress relief at the gap locations, preventing delamination.
Solution Approach 2:
The gaps in the warpage control structure act as intermediary stress-relief zones. These gaps allow the structure to mediate between the need for warpage control (providing structural support) and the need for stress relief (preventing delamination).
Data Source
AI summary
A package includes a package substrate, the package substrate having a first side and a second side opposite to the first side, a package component bonded to the first side of the package substrate, a front-side warpage control structure attached to the first side of the package substrate, and a backside warpage control structure embedded in the package substrate from the second side of the package substrate. The front-side warpage control structure includes a first disconnected structure and a second disconnected structure laterally separated from each other by a gap. The backside warpage control structure includes a third disconnected structure and a fourth disconnected structure laterally separated from each other.