IC Package Waveguide Launcher Integration

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Solution Overview

Problem

Integrated circuit (IC) packages face significant power losses due to the distance and number of interconnections between the IC die and waveguide launchers, which are exacerbated by the use of low-loss dielectric materials that are expensive and increase insertion loss.

Innovation Solution

Incorporating a waveguide launcher directly on the substrate within the IC package, electrically coupled to the IC die, reduces the distance and number of interconnections, and using a multilayer substrate with patterned metal layers and vias to minimize power losses, while allowing the substrate itself to be formed from low-loss materials, thereby reducing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If the waveguide launcher is placed far from the IC die with multiple interconnections, then the IC package can be mounted on a standard PCB, but power losses and insertion loss increase significantly

Engineering Contradiction:

Improvepower lossVSAvoiddistance between IC die and waveguide launcher

Core Design Contradiction:

Loss of energyVSLength of moving object

Solution Approach 1:

The waveguide launcher is integrated directly onto the substrate within the IC package, merging previously separate components (IC die, substrate, and waveguide launcher) into a single unified package. This integration dramatically reduces the distance between the IC die and waveguide launcher, minimizing power losses and insertion loss while maintaining compatibility with standard PCB mounting.

Inventive Principle:

Principle #5Merging (Combining)

2Loss of energy

If low-loss dielectric materials are used in the PCB, then insertion loss into the waveguide launcher decreases, but manufacturing costs increase

Engineering Contradiction:

Improveinsertion lossVSAvoidmanufacturing cost

Core Design Contradiction:

Loss of energyVSEase of manufacture

Solution Approach 1:

Low-loss dielectric materials are used only in the critical region of the substrate immediately surrounding the waveguide launcher and IC die, rather than throughout the entire PCB. This localized application maintains low insertion loss in the most critical signal path while reducing overall material costs and improving ease of manufacture for the complete assembly.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS9136230B2IC package with integrated waveguide launcher

Publication Date: 2015.09.15 MAXLINEAR ASIA SINGAPORE PTE LTD

AI summary

Embodiments described herein include an integrated circuit (IC) device. For example, the IC device can include a substrate configured to be coupled to a printed circuit board (PCB), an IC die attached to the substrate, and a waveguide launcher formed on the substrate. The waveguide launcher is electrically coupled to the IC die through the substrate.