IC Package System with Window Opening for Stacked Memory
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Solution Overview
Problem
Current integrated circuit memory modules, such as Secure Digital and Multi Media cards, face limitations in memory capacity due to standard dimensional constraints, which hinder the inclusion of more memory within the same form factor, leading to increased complexity and costs in manufacturing.
Innovation Solution
The integrated circuit package system features a top lid with an integrated circuit window opening, allowing for additional space and enabling the stacking of integrated circuits, which increases memory capacity while maintaining compatibility with standard form factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of integrated circuit memory devices is increased within current memory modules, then memory capacity is improved, but manufacturing complexity and mounting difficulty increase significantly
Solution Approach 1:
The patent implements a stacked configuration where multiple integrated circuit memory devices are vertically arranged one above another, with each device nested within the same package footprint. This nesting approach allows increasing memory capacity by adding devices in the vertical dimension rather than spreading them horizontally, thereby avoiding increased mounting complexity while achieving higher density within the same package dimensions.
Solution Approach 2:
The patent transitions from a traditional planar arrangement of memory devices to a three-dimensional stacked configuration. By utilizing the vertical dimension (Z-axis) to stack multiple devices, the system achieves higher memory capacity without expanding the package footprint or increasing mounting complexity, effectively solving the contradiction through dimensional transformation.
2Quantity of substance
If more integrated circuits are stacked within standard form factors, then memory capacity increases, but manufacturing yield decreases
Solution Approach 1:
The patent divides the stacked memory structure into modular units with standardized interfaces and alignment features. Each memory device in the stack is designed as an independent module with consistent dimensional specifications, allowing for standardized manufacturing processes and simplifying quality control. This segmentation enables easier assembly and testing, thereby maintaining manufacturing yield while achieving higher capacity through stacking.
Solution Approach 2:
The patent optimizes critical parameters such as the thickness of interconnect layers, alignment tolerances, and bonding pressures to ensure reliable stacking. By carefully controlling these parameters within specific ranges, the system achieves high manufacturing yield despite the increased complexity of multi-device stacking, resolving the contradiction between capacity increase and yield maintenance.
3Quantity of substance
If standard form factors are maintained, then device compatibility is preserved, but memory capacity expansion is limited
Solution Approach 1:
The patent maintains the standard form factor dimensions in the horizontal plane (X-Y axes) to ensure compatibility with existing devices, while simultaneously utilizing the vertical dimension (Z-axis) to stack multiple memory devices. This approach allows memory capacity expansion without changing the package footprint, effectively resolving the contradiction between maintaining form factor standards and achieving capacity expansion.
Data Source
AI summary
An integrated circuit package system includes a bottom lid, a base integrated circuit over the bottom lid, and a top lid with an integrated circuit window opening over the bottom lid.