IC Packaging Bonding Interconnect for High Density and Yield
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Solution Overview
Problem
Conventional semiconductor package structures face challenges in miniaturization, reliability, and cost-effectiveness, particularly in portable devices, where they struggle to achieve high packaging density, low profile, and improved performance while maintaining competitive pressures and consumer expectations.
Innovation Solution
The method involves creating an integrated circuit packaging system with a die paddle, lead, and internal interconnects, where a bonding interconnect is formed on the bond pad of the integrated circuit, and the circuit end of the internal interconnect is attached to the bonding interconnect, with the lead end connected to the lead, eliminating the need for forming gases and reducing processing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional semiconductor package structures are used, then packaging density can be increased, but reliability and manufacturing yield deteriorate
Solution Approach 1:
The patent introduces a bonding interconnect as an intermediary element between the internal interconnect and the bond pad. This bonding interconnect serves as a mediator that facilitates reliable electrical connection while enabling miniaturization. The bonding interconnect includes a bonding portion that bonds to the bond pad and an internal interconnect portion that connects to the internal interconnect, thereby resolving the contradiction between high packaging density and manufacturing reliability.
2Volume of moving object
If package miniaturization is pursued, then product size and thickness are reduced, but manufacturing complexity increases
Solution Approach 1:
The patent segments the interconnect structure into distinct functional portions: a bonding interconnect with a bonding portion and an internal interconnect portion, and a separate internal interconnect. This segmentation allows each component to be optimized independently for its specific function, simplifying the manufacturing process while achieving miniaturization. The bonding interconnect can be formed using standard bonding processes, while the internal interconnect can be integrated separately.
3Quantity of substance
If POP designs are implemented, then packaging density improves, but cost and reliability challenges increase
Solution Approach 1:
The patent merges the bonding interconnect and internal interconnect into a single integrated structure that can be formed in one manufacturing process. The bonding interconnect includes both a bonding portion for connecting to the bond pad and an internal interconnect portion for connecting to the internal interconnect, eliminating the need for separate assembly steps required by POP designs. This integration reduces manufacturing complexity and cost while maintaining high packaging density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances connectivity, reliability, and yield by forming a robust intermetallic bond and reducing the force required during bonding, thus improving electrical connectivity and reducing manufacturing costs.
Implementation Method 1
forming a robust intermetallic bond
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a die paddle and a lead adjacent to the die paddle; mounting an integrated circuit, having a bond pad, over the die paddle; forming a bonding interconnect on the bond pad; attaching a circuit end of an internal interconnect to the bonding interconnect, the bonding interconnect between the circuit end and the bond pad; and connecting a lead end of the internal interconnect to the lead.