IC Packaging with Coining Process Interconnects
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges in miniaturization, cost reduction, and manufacturing efficiency, particularly in portable devices, where they need to be smaller, thinner, and more cost-effective while maintaining performance.
Innovation Solution
The method involves a base substrate with a mounted integrated circuit device, an interposer with a package interconnect having an irregular surface from a coining process, and an encapsulation between the interposer and the substrate, which allows for precise control of the package interconnect's height and eliminates the need for laser ablation and via cleaning, enabling efficient manufacturing and cost reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional packaging methods are used, then manufacturing processes are simpler, but packaging dimensions cannot be reduced sufficiently
Solution Approach 1:
The packaging system is divided into distinct functional layers: base substrate, interposer, and encapsulation. The interposer itself is segmented into multiple interconnect structures (first, second, and third interconnects) that perform different functions, allowing each segment to be optimized independently for miniaturization while maintaining manufacturability.
Solution Approach 2:
The patent implements a nested structure where the first interconnect is positioned within the base substrate, the second interconnect is positioned within the interposer, and the third interconnect connects these layers. This nesting approach allows multiple interconnection functions to be packed into a smaller overall volume, directly addressing the miniaturization requirement.
2Manufacturing precision
If additional manufacturing processes like laser ablation and via cleaning are implemented, then manufacturing precision improves, but manufacturing cost and time increase
Solution Approach 1:
The patent performs preliminary formation of through-vias and interconnect structures during the base substrate fabrication process before the final assembly stage. The first interconnect is pre-formed within the base substrate, and the second interconnect is pre-formed within the interposer, eliminating the need for post-assembly laser ablation and via cleaning operations.
Solution Approach 2:
The patent extracts and eliminates the need for laser ablation and via cleaning processes from the manufacturing workflow. By redesigning the interconnect formation approach to use pre-formed structures and alternative attachment methods, these complex and time-consuming processes are completely removed while maintaining manufacturing precision.
3Length of stationary object
If package interconnect height is reduced for low-profile applications, then packaging dimensions improve, but structural integrity may be compromised
Solution Approach 1:
The patent applies different structural configurations to different interconnects based on their specific functional requirements. The first interconnect within the base substrate has one structural configuration, while the second and third interconnects have different configurations optimized for their respective positions and loading conditions. This local optimization allows height reduction while maintaining structural integrity in each specific location.
Solution Approach 2:
The patent employs composite material structures in the interconnect design, combining different materials with complementary properties. The interposer and base substrate use composite constructions that provide both mechanical strength and electrical functionality, enabling reduced interconnect height while maintaining overall structural integrity through material optimization.
4Productivity
If more reflow processes are eliminated to reduce manufacturing steps, then productivity improves, but adhesion and reliability may be affected
Solution Approach 1:
The patent replaces thermal reflow processes with mechanical compression and bonding approaches. The interconnect structures are attached through controlled compression during assembly rather than through repeated thermal reflow cycles. This mechanical substitution maintains adhesion quality while eliminating the need for multiple reflow processes, thereby improving productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves reduced packaging dimensions, improved manufacturing efficiency, and cost-effectiveness by allowing for customizable low-profile heights and eliminating the need for additional reflow processes, while ensuring structural integrity and adhesion.
Implementation Method 1
the package interconnect coined onto the bottom pad
Data Source
AI summary
An integrated circuit packaging system and method of manufacture thereof includes: a base substrate having a bottom pad; an integrated circuit device mounted on the base substrate; an interposer having a package interconnect mounted on the base substrate, the package interconnect includes an underside base portion having an irregular surface characteristic of a coining process; and an encapsulation between the interposer and the base substrate.