IC Packaging with Conductive Pillars and Molded Cavities
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Solution Overview
Problem
Current integrated circuit packaging technologies face challenges in achieving smaller footprints, increased robustness, and reduced manufacturing costs while addressing issues like EMI radiation, thermal loads, and second-level assembly reliability stresses, with existing solutions failing to provide effective answers.
Innovation Solution
The development of an integrated circuit packaging system that includes a substrate with conductive posts having vertical sides, an integrated circuit attached to the substrate, and an encapsulant with molded cavities formed by film-assisted molding, which exposes the conductive posts and provides mechanical stability and increased connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional packaging methods are used, then manufacturing robustness is maintained, but manufacturing costs increase and productivity decreases
Solution Approach 1:
The patent combines the molding process with the formation of conductive post structures into a single integrated step. The mold cavity design allows the encapsulant to be formed while simultaneously creating the conductive post structures, eliminating the need for separate laser ablation and molding operations. This merging of processes reduces manufacturing cost and improves productivity by reducing the number of discrete manufacturing steps.
2Ease of manufacture
If laser ablation is used to create conductive posts, then connectivity is achieved, but manufacturing cost increases and time consumption increases
Solution Approach 1:
The patent incorporates conductive material within the mold cavity design before the molding process begins. This preliminary placement of conductive material allows the conductive posts to be formed during the encapsulant molding process itself, rather than requiring subsequent laser ablation steps. The conductive material is pre-positioned to ensure reliable connectivity while reducing manufacturing time and cost.
3Area of stationary object
If package size is reduced, then footprint is smaller, but mechanical support and robustness deteriorate
Solution Approach 1:
The patent employs a mold cavity design that creates localized structural features within the encapsulant. The cavity walls and internal structures provide concentrated mechanical support at critical locations while maintaining an overall small package footprint. This local reinforcement approach ensures mechanical robustness without increasing the total package size, as the structural strength is distributed strategically rather than uniformly throughout the entire package.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a conductive post on the substrate, the conductive post includes a vertical side; attaching an integrated circuit to the substrate; and forming an encapsulant including a molded cavity, the vertical side circumscribed by and exposed within the molded cavity from the encapsulant.