IC Packaging Coplanar Leads for High I/O Connectivity
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Solution Overview
Problem
Current integrated circuit packaging systems, such as quad flat packs, lack sufficient input/output capabilities, necessitating a solution that enhances connectivity without increasing package thickness to accommodate highly integrated electronic devices.
Innovation Solution
The method involves forming a lead frame with contact pads and connection leads, coupling a base integrated circuit to these pads, and molding a package body that exposes the contact pads while forming connection leads to be coplanar with the package body's bottom surface, thereby increasing connectivity without adding thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional input/output capabilities are added to QFP packages, then connectivity is improved, but package thickness increases
Solution Approach 1:
The patent transitions from traditional side-lead connections to bottom-surface connections by making connection leads coplanar with the bottom surface of the package body. This dimensional change allows additional I/O capabilities to be integrated without increasing package thickness, as connections are now accessed from the bottom plane rather than extending from side surfaces.
Solution Approach 2:
The patent segments the connection functionality by distinguishing between traditional side leads and new bottom-surface connection leads. This segmentation allows independent optimization of each connection type, enabling increased I/O capacity through bottom connections while maintaining the original side-lead configuration for backward compatibility.
2Ease of operation
If connection leads are made coplanar with the bottom surface, then assembly is simplified, but manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates coplanarity features directly into the mold design and lead frame structure during the packaging process. By pre-establishing the coplanar relationship between connection leads and the bottom surface through molding, the patent eliminates the need for post-assembly adjustments, thereby simplifying assembly while managing precision requirements through process integration.
3Adaptability or versatility
If contact pads are exposed on the package body, then connectivity is increased, but package complexity increases
Solution Approach 1:
The patent makes the bottom surface of the package body multi-functional by integrating both structural support and electrical connection functions. The exposed contact pads on the bottom surface serve dual purposes: providing mechanical support for the package and enabling electrical connections, thereby increasing connectivity options without proportionally increasing structural complexity.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming a lead frame having contact pads and connection leads; coupling a base integrated circuit to the contact pads; coupling a chip interconnect between the base integrated circuit, the connection leads, the contact pads, or a combination thereof; molding a package body on the connection leads, the base integrated circuit, and the chip interconnects, including having the contact pads exposed; and forming a bottom surface on the package body including forming the connection leads to be coplanar with the bottom surface.