Ultra-Thin IC Packaging via Nonconductive Cover and Substrate Segmentation
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges in miniaturization, cost reduction, and manufacturing efficiency, particularly in portable devices, where existing solutions have not effectively addressed the need for smaller, thinner, and more densely packed components with improved yields and flexible integration configurations.
Innovation Solution
The method involves a circuit substrate with an active side and an inactive portion, where a nonconductive cover is attached to the active side, a separation-gap is formed, and back-grinding tape is used to remove a portion of the inactive substrate, resulting in an integrated circuit packaging system with a non-conductive layer between the substrate and the die, featuring a non-concave perimeter surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If conventional IC packaging methods are used, then manufacturing process is simpler, but package thickness cannot be reduced to ultra-thin levels
Solution Approach 1:
The substrate is divided into active and inactive portions, with the inactive portion being selectively removed through precision cutting and back-grinding processes. This segmentation enables ultra-thin package thickness while maintaining structural integrity through the nonconductive cover that spans the separation-gap.
Solution Approach 2:
The nonconductive cover is attached to the active side before the separation-gap is formed and before back-grinding is performed. This preliminary attachment provides structural support during subsequent processing steps, enabling the substrate to be thinned to ultra-thin dimensions without compromising strength.
2Length of stationary object
If substrate is thinned to reduce package dimensions, then portability is improved, but stress-related damages increase
Solution Approach 1:
The nonconductive cover is attached beforehand to provide mechanical support and cushioning to the ultra-thin substrate. This cover prevents stress-related damages during handling and operation by distributing mechanical loads across the active side, compensating for the reduced thickness.
Solution Approach 2:
The packaging system combines the substrate material with a nonconductive cover material to create a composite structure. This composite provides both the ultra-thin profile needed for portability and the mechanical strength needed to resist stress-related damages.
3Productivity
If nonconductive cover is attached before separation-gap formation, then manufacturing yield increases, but process complexity increases
Solution Approach 1:
The nonconductive cover serves multiple functions: it provides structural support during processing, defines the separation-gap boundaries, and becomes part of the final packaging structure. This multi-functionality justifies the additional process step by eliminating the need for separate support structures.
Solution Approach 2:
The nonconductive cover attached before separation-gap formation acts as a self-aligning feature during cutting. The cover's edges guide the cutting process, ensuring precise gap formation without requiring additional alignment fixtures or complex positioning systems.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a circuit substrate having an active side opposite to an inactive portion; attaching a nonconductive cover to the active side; forming a separation-gap partially cutting into the nonconductive cover and the circuit substrate to a kerf depth; attaching a back-grinding tape to the nonconductive cover; removing a portion of the inactive portion; and exposing the nonconductive cover by removing the back-grinding tape.