Integrated Circuit Packaging with Horizontal Integration

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Solution Overview

Problem

The challenge lies in developing an integrated circuit packaging system that achieves miniaturization, increased density, and reduced costs while addressing the limitations of existing technologies that fail to fully integrate more functions and reduce physical space and costs effectively in portable electronic devices.

Innovation Solution

The solution involves forming a lead with an interior conductive layer, mounting an integrated circuit with an inactive and active side, and applying an encapsulation and insulation layer to provide mechanical and environmental protection, thereby reducing the vertical height profile and enhancing reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If integrated circuits are stacked into a single package to increase density, then packaging density is improved, but vertical height increases

Engineering Contradiction:

Improvepackaging densityVSAvoidvertical height

Core Design Contradiction:

Quantity of substanceVSLength of moving object

Solution Approach 1:

The patent transitions from vertical stacking to horizontal integration by arranging multiple integrated circuits side-by-side on a single package substrate. This dimensional change allows increased component density without increasing the vertical height of the package, directly resolving the contradiction between density and height.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If more integrated circuits are integrated into a package, then functionality is improved, but physical space requirements increase

Engineering Contradiction:

ImprovefunctionalityVSAvoidphysical space

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent merges multiple integrated circuits onto a single package substrate with shared interconnection structures and common packaging elements. This consolidation increases functionality within a reduced physical footprint by eliminating redundant packaging components and optimizing space utilization through integrated design.

Inventive Principle:

Principle #5Merging (Combining)

3Ease of manufacture

If traditional packaging structures are used, then manufacturing simplicity is maintained, but cost reduction goals are not achieved

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidcost efficiency

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent employs universal packaging structures and standardized interconnection designs that can accommodate multiple integrated circuits with different functions. This multi-functional approach enables cost reduction through economies of scale in manufacturing while maintaining simplicity in the packaging process, as the same basic structure serves multiple purposes.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS8525325B2Integrated circuit packaging system with leads and method of manufacture thereof

Publication Date: 2013.09.03 STATS CHIPPAC LTD

AI summary

A method of manufacture of an integrated circuit packaging system includes: forming a lead; forming an interior conductive layer having an interior top side and an interior bottom side, the interior bottom side directly on the lead; mounting an integrated circuit over the lead, the integrated circuit having an inactive side and an active side; forming an encapsulation directly on the inactive side and the interior top side; and forming an insulation layer directly on the active side and a portion of the interior bottom side.