Integrated Circuit Packaging with Indent and Conformal Interconnect
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Solution Overview
Problem
Conventional semiconductor package structures face challenges in miniaturization, reliability, and cost-effectiveness, particularly in portable devices, where they require smaller, thinner, and more densely packed integrated circuits with higher performance.
Innovation Solution
The development of an integrated circuit packaging system that includes an indent with a flange and a conformal interconnect having elevated, sloped, and flange segments, which provides a low-profile connection option with high capacity and density mounting pads, enabling robust and reliable contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor package structures are used, then manufacturing is simpler, but miniaturization and packaging density are limited
Solution Approach 1:
The patent implements package-on-package (POP) architecture where a first integrated circuit package is nested within or coupled to a second integrated circuit package. This nesting approach enables vertical stacking of multiple packages, significantly reducing the overall footprint and achieving miniaturization while maintaining functional complexity through hierarchical integration.
Solution Approach 2:
The patent transitions from planar packaging to three-dimensional vertical stacking by coupling packages in the vertical dimension. The first and second packages are arranged in stacked configurations with interconnects extending between layers, utilizing the Z-axis dimension to increase packaging density without increasing lateral footprint.
2Quantity of substance
If package-on-package design is used, then packaging density increases, but reliability challenges arise
Solution Approach 1:
The patent divides the interconnect structure into multiple functional segments: solder balls/bumps for vertical coupling, underfill material for stress relief and alignment, and molded compound for mechanical protection. This segmentation allows each component to address specific reliability challenges independently, with underfill compensating for misalignment and solder providing robust electrical connection.
Solution Approach 2:
The patent applies underfill material between the first and second packages before molding, providing beforehand cushioning against thermal stress, mechanical shock, and alignment variations. This pre-applied cushioning layer prevents stress concentration at critical interfaces, ensuring reliability under varying operating conditions.
3Length of moving object
If miniaturization is pursued, then device size decreases, but manufacturing cost increases
Solution Approach 1:
The patent performs preliminary actions by pre-assembling and pre-testing the first integrated circuit package before coupling it to the second package. The first package is manufactured, tested, and packaged independently, allowing for quality verification and repair opportunities before the complex POP assembly process, thereby reducing overall manufacturing cost and improving yield.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes providing an integrated circuit having an active side and a non-active side; forming an indent, having a flange and an indent side, from a peripheral region of the active side; and forming a conformal interconnect, having an elevated segment, a slope segment, and a flange segment, over the indent.