Dual-Sided IC Packaging via Pre-Formed Interposer
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Solution Overview
Problem
Conventional integrated circuit packaging systems face challenges in achieving high connectivity, low cost manufacturing, and reduced size, particularly in miniaturizing semiconductor packages for portable devices, where existing solutions have not effectively addressed the need for increased density and performance while minimizing size and cost.
Innovation Solution
The method involves mounting an integrated circuit over a substrate with a device through via, attaching a conductive support, and using a pre-formed interposer with pre-attached interconnects, which is then encapsulated, providing a robust and reliable connection structure that reduces mechanical and electrical gaps and allows dual connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are molded into resin or stacked multiple times, then packaging density and performance are improved, but device size and thickness increase
Solution Approach 1:
The patent implements package-on-package (POP) stacking where multiple integrated circuit packages are vertically stacked and interconnected through through-vias. The lower package contains a first integrated circuit with connection pads, while the upper package contains a second integrated circuit that connects to the lower package via through-vias passing through the lower package substrate. This nested configuration achieves high packaging density without significantly increasing the horizontal footprint of the device.
Solution Approach 2:
The patent transitions from horizontal packaging arrangements to vertical stacking by utilizing the third dimension (height). Through-vias are formed through the substrate to enable electrical connections between packages stacked in the vertical direction. This dimensional change allows multiple circuits to be packed in a compact volume, improving density while maintaining a small form factor suitable for portable devices.
2Volume of moving object
If package size is reduced for portability, then device portability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent employs pre-formed interposers that are prepared separately with embedded conductive structures and connection pads before being integrated into the final package assembly. These pre-formed interposers include pre-configured through-vias and connection structures that simplify the overall manufacturing process. By preparing components in advance with pre-established connections, the patent reduces assembly complexity despite the compact package size and multi-layer structure.
Solution Approach 2:
The patent divides the integrated circuit package into separate functional modules: a lower package with first integrated circuit, an upper package with second integrated circuit, and pre-formed interposers with conductive structures. Each module is manufactured and tested independently, then assembled through controlled connections. This segmentation allows for simplified manufacturing of individual components while achieving complex functionality in the final compact package.
3Reliability
If connectivity is increased for higher performance, then system performance is improved, but number of connection structures and cost increase
Solution Approach 1:
The patent designs through-vias to serve multiple functions: they provide mechanical support between stacked packages, establish electrical connections between different circuit layers, and enable signal, power, and ground pathways simultaneously. The pre-formed interposers with integrated conductive structures provide universal connection interfaces that can accommodate multiple connection types without requiring separate specialized structures for each connection function, thereby reducing overall complexity.
Solution Approach 2:
The patent introduces pre-formed interposers as intermediary components between the lower and upper packages. These interposers contain embedded conductive structures that mediate the electrical connections between packages, simplifying the connection architecture. The interposers act as intermediate connection layers that reduce the complexity of direct package-to-package bonding by providing pre-configured connection pathways and reducing the number of direct connection points required.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a device through via and a device interconnect, over a substrate with the device through via traversing the integrated circuit and the device interconnect attached to the device through via; attaching a conductive support over the substrate with the conductive support adjacent to the integrated circuit; providing a pre-formed interposer, having an interposer through via and a pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via; mounting the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via; and forming an encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer.