3D IC Packaging with Interposer to Reduce Warpage
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Solution Overview
Problem
Conventional semiconductor package structures face challenges in miniaturization, reliability, and cost due to warpage during solder reflow, particularly in package-on-package designs, which affect the performance and portability of devices like cellular phones and notebook computers.
Innovation Solution
The integration of a package carrier with a circuit interposer and conductive pillars provides mechanical support and electrical connectivity, allowing for direct access to the package carrier and next system levels, enhancing heat dissipation and reliability while maintaining a low profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If package-on-package designs are used to increase packaging density, then component density is improved, but warpage during solder reflow increases
Solution Approach 1:
A circuit interposer is introduced as an intermediary component between the integrated circuit and the package carrier. The interposer provides a stable intermediate platform that distributes thermal and mechanical stresses, preventing warpage in the package substrate during solder reflow while enabling increased packaging density through vertical stacking.
Solution Approach 2:
The packaging system is segmented into distinct functional layers: the package carrier, the integrated circuit, the circuit interposer, and the mounting integrated circuit. This segmentation allows each component to be optimized independently and provides multiple interfaces for stress distribution, reducing overall warpage while maintaining high packaging density.
2Volume of moving object
If package size is reduced for miniaturization, then device portability is improved, but reliability during solder reflow deteriorates
Solution Approach 1:
The packaging system transitions from a two-dimensional planar layout to a three-dimensional vertical stacking architecture. By utilizing the vertical dimension with multiple layers (package carrier, integrated circuit, circuit interposer, mounting integrated circuit), the design achieves miniaturization in the planar footprint while maintaining reliability through the added structural dimensions that provide thermal and mechanical management pathways.
3Volume of moving object
If conventional POP designs are used to achieve miniaturization, then device size is reduced, but manufacturing cost increases
Solution Approach 1:
The circuit interposer serves multiple functions simultaneously: it provides mechanical support to prevent warpage, establishes electrical connections between layers, facilitates thermal management, and enables the vertical stacking architecture. This multi-functionality reduces the need for additional specialized components and processes, thereby controlling manufacturing costs while achieving miniaturization.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system including: providing a package carrier; mounting an integrated circuit to the package carrier; mounting a circuit interposer above the integrated circuit; mounting a mounting integrated circuit above the circuit interposer; forming a conductive pillar to the circuit interposer adjacent to the mounting integrated circuit; connecting the circuit interposer to the package carrier; and forming an encapsulation on the package carrier.