Integrated Circuit Packaging with Jumper Pads and Posts
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Solution Overview
Problem
Conventional semiconductor package structures face challenges in miniaturization, reliability, and cost-effectiveness, particularly in portable devices, where they require smaller, thinner, and more densely packed integrated circuits with improved yield and reduced costs.
Innovation Solution
The method involves forming a paddle with an inner and outer post, a jumper pad between them, and connecting jumper interconnects between the integrated circuit and these posts, encapsulating the structure to enhance connectivity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor package structures are used, then manufacturing is simpler, but miniaturization and packaging density are limited
Solution Approach 1:
The package structure is segmented into distinct functional zones: a paddle region for mechanical support, an inner post region for primary electrical connections, and an outer post region for additional connections. This segmentation allows each region to be optimized independently, enabling miniaturization while maintaining structural integrity and electrical functionality.
Solution Approach 2:
The patent transitions from conventional two-dimensional planar layouts to a three-dimensional structure with vertical posts extending from the paddle. This dimensional change allows multiple connection points to be stacked vertically, increasing packaging density without increasing the footprint area, thus achieving miniaturization.
2Reliability
If wire lengths are reduced to improve reliability, then connectivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The posts are pre-formed on the paddle before wire bonding, establishing fixed reference points for wire attachment. This preliminary action eliminates the need for complex alignment procedures during wire bonding, reducing manufacturing precision requirements while ensuring short, reliable wire lengths for improved connectivity.
Solution Approach 2:
The posts serve as intermediary connection elements between the paddle and the external circuitry. By introducing these intermediate connection points, the patent reduces the required wire length between connection points while providing well-defined attachment locations that simplify manufacturing precision requirements.
3Area of stationary object
If packaging density is increased to meet portable device requirements, then device size is reduced, but reliability challenges increase
Solution Approach 1:
Different regions of the package are assigned different functional qualities: the paddle provides mechanical strength and thermal dissipation, the inner posts provide primary electrical connections with short wire lengths for high reliability, and the outer posts provide additional connectivity. This local differentiation allows high packaging density while maintaining reliability through optimized local structures.
Solution Approach 2:
The package employs a composite structure combining the paddle material (for mechanical support), post materials (for electrical conductivity), and encapsulation material (for protection). This composite approach enables miniaturization while maintaining the reliability of each functional component through material optimization.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming a paddle, an inner post adjacent to the paddle, a jumper pad, and an outer post, with the jumper pad between the inner post and the outer post; mounting an integrated circuit over a paddle first side, the paddle first side co-planar with the outer post; connecting a first jumper interconnect between the integrated circuit and the jumper pad; connecting a second jumper interconnect between the jumper pad and the outer post; and forming an encapsulation over paddle, the integrated circuit, the first jumper interconnect, the jumper pad, and the second jumper interconnect.