Integrated Circuit Packaging with Locking Stand-off Leads
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Solution Overview
Problem
The electronic industry faces challenges in creating integrated circuit packaging systems that are smaller, more reliable, and cost-effective while meeting increasing commercial pressures and consumer demands for lighter, faster, and multi-functional devices.
Innovation Solution
The method involves providing a lead frame with a hole and lead extension, connecting an electrical interconnect to an integrated circuit, forming an encapsulation around the circuit and interconnect, and removing the bottom portion of the lead frame to create a stand-off lead with an exterior pad, resulting in a packaging system with stand-off leads and a die paddle that are partially enclosed by the encapsulation for improved reliability and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional packaging methods are used, then manufacturing simplicity is maintained, but reliability and heat dissipation are insufficient
Solution Approach 1:
The lead frame is segmented by removing portions between functional elements, creating separate stand-off leads and die paddle regions. This segmentation improves reliability by isolating electrical connections and enhancing heat dissipation paths, while the modular nature maintains manufacturing simplicity through standardized processing steps.
Solution Approach 2:
The packaging structure transitions from a planar lead frame to a three-dimensional configuration with stand-off leads extending vertically. This dimensional change creates spacing that improves reliability by preventing short circuits and enhancing heat dissipation, while the leads remain manufacturable through standard lead frame fabrication processes.
2Volume of moving object
If packaging size is reduced, then device footprint decreases, but heat dissipation capability deteriorates
Solution Approach 1:
By segmenting the lead frame structure into removed portions and retained stand-off leads, the invention creates optimized heat dissipation pathways. The removed portions eliminate thermal barriers, while the retained leads provide direct thermal conduction paths from the die to the exterior pads, enabling effective heat dissipation in a compact volume.
Solution Approach 2:
Portions of the lead frame are extracted (removed) to create stand-off leads with exterior pads. This extraction eliminates unnecessary material that would impede heat flow, creating direct thermal pathways from the integrated circuit through the stand-off leads to the exterior environment, thereby improving heat dissipation without increasing package volume.
3Temperature
If lead frame material is removed, then heat dissipation improves, but structural strength may decrease
Solution Approach 1:
The selective segmentation of the lead frame creates stand-off leads that maintain structural integrity where needed (at the die paddle and lead extensions) while removing material only in non-critical regions. This segmented approach preserves pull strength by retaining the essential load-bearing structures while improving heat dissipation through strategic material removal.
Solution Approach 2:
Different regions of the lead frame have different material densities - full material at the die paddle and lead extensions for strength, and reduced material (stand-off leads with exterior pads) in regions optimized for heat dissipation. This local quality variation ensures structural strength is maintained where required while heat dissipation is enhanced where material is removed.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a lead frame having a hole, a lead extension, and an exterior pad under the lead extension with the hole abutting the lead extension; connecting an electrical interconnect between an integrated circuit and the lead extension; forming an encapsulation over the integrated circuit and surrounding the electrical interconnect and through the hole; and removing a bottom portion of the lead frame resulting in a stand-off lead from the lead extension with the exterior pad on the stand-off lead.