IC Packaging Metallurgy Layer Overlap for Compact Assembly
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Solution Overview
Problem
Conventional IC packaging methods struggle to reduce the volume of ultra-small IC chips in portable devices, leading to issues like solder emptying and poor assembly yields due to the limitations in size reduction.
Innovation Solution
The proposed IC packaging structure includes a die with a contact portion, a saw reserved portion, and a seal ring, where a metallurgy layer is disposed on the contact portion and overlaps the seal ring or saw reserved portion, using a solderable layer coated with solder paste to couple with a solder pad on a carrier board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional packaging method is used to package ultra-small IC chip, then the IC chip can be packaged, but the volume of the IC packaging object cannot be reduced and solder empty easily occurs
Solution Approach 1:
The metallurgy layer is extended to overlap the seal ring in the lateral dimension, rather than only extending in the vertical direction. This dimensional change allows the metallurgy layer to provide sufficient soldering area while maintaining compact packaging volume, preventing solder emptying while reducing overall packaging size.
Solution Approach 2:
The metallurgy layer is pre-formed to overlap the seal ring before the packaging process. This preliminary configuration ensures that when solder paste is applied, there is already sufficient metallurgical area available for reliable soldering, preventing solder emptying issues that would occur with conventional packaging dimensions.
2Volume of moving object
If the distance between metallurgy layer and saw reserved portion is reduced to enable ultra-small IC packaging, then the packaging volume is reduced, but solder emptying occurs
Solution Approach 1:
Instead of reducing the distance in the lateral direction (which would compromise soldering quality), the metallurgy layer is extended in the lateral dimension to overlap the seal ring. This provides additional soldering area without reducing the critical distance to the saw reserved portion, maintaining manufacturing precision while achieving compact packaging.
Solution Approach 2:
The configuration parameter of the metallurgy layer is changed from a conventional rectangular pattern to an extended pattern that overlaps the seal ring. This parameter change increases the effective soldering area while maintaining appropriate spacing from the saw reserved portion, enabling both small packaging volume and high soldering quality.
3Volume of moving object
If metallurgy layer is extended to overlap seal ring, then the distance to saw reserved portion is reduced enabling ultra-small packaging, but the complexity of packaging structure increases
Solution Approach 1:
The metallurgy layer is merged with the seal ring area, where the metallurgy layer extends to overlap the seal ring. This merging creates a unified structure that serves both as a structural element and a soldering surface, reducing the need for separate components and simplifying the overall packaging structure despite the extended coverage.
Solution Approach 2:
The metallurgy layer serves multiple functions: it provides the soldering surface for electrical connection, acts as a structural support element, and extends into the seal ring area to maximize space utilization. This multi-functionality reduces the need for additional separate components, thereby reducing overall packaging complexity while achieving ultra-small dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a more compact IC packaging structure, reducing the distance between the metallurgy layer and the saw reserved portion, thereby enabling the use of ultra-small ICs in small-sized portable devices like smart watches and smart glasses with improved assembly yields.
Implementation Method 1
The metallurgy layer includes a solderable layer coated by a solder paste. The carrier board includes a solder pad. The solder pad is coupled to the solderable layer coated by the solder paste.
Data Source
AI summary
A portable apparatus, an IC packaging structure, an IC packaging object, and an IC packaging method thereof are disclosed. The IC packaging structure includes an IC packaging object and a substrate. The packaging object includes a die and a metallurgy layer. The die has a contact portion, a saw reserved portion, and a seal ring. The seal ring is disposed between the contact portion and the saw reserved portion. The metallurgy layer is disposed on the contact portion. At least a part of the metallurgy layer overlaps the seal ring. The metallurgy layer includes a solderable layer coated by a solder paste. The substrate includes a solder pad. The solder pad is coupled to the solderable layer coated by the solder paste.