IC Packaging Mold Gate with Encapsulant Disruption Patterns
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current integrated circuit packaging technologies face challenges with increasing clock rates, EMI radiation, thermal loads, second-level assembly reliability stresses, and cost, particularly in producing smaller, more robust packages with reduced warpage and improved performance for portable electronics.
Innovation Solution
The method involves forming a mold gate on a substrate, mounting an integrated circuit, and using an encapsulant with disruption patterns emanating from the mold gate to encapsulate the circuit, which reduces warpage and mechanical stress, and enhances thermal performance by allowing side horizontal injection and transfer molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If conventional packaging methods are used, then manufacturing is simpler, but warpage and mechanical stress increase
Solution Approach 1:
The encapsulant is divided into multiple regions with different properties: a first region with disruption patterns emanating from the mold gate and a second region without disruption patterns. This segmentation allows different portions of the encapsulant to serve different functions - the first region controls warpage and stress while the second region provides standard encapsulation.
Solution Approach 2:
The encapsulant has non-uniform local properties through the disruption patterns that are concentrated in the first region. The disruption patterns create localized variations in material structure that specifically address warpage and mechanical stress in critical areas near the mold gate, while other regions maintain uniform properties.
2Volume of moving object
If package size is reduced, then portability improves, but thermal management becomes more difficult
Solution Approach 1:
The disruption patterns are arranged in specific geometric configurations (concentric circles, radial lines, grids) that create three-dimensional stress distribution and thermal pathways within the encapsulant. This dimensional structuring allows efficient heat dissipation in compact packages by creating multiple thermal conduction paths through the encapsulant material.
3Manufacturing precision
If manufacturing precision is increased, then product quality improves, but manufacturing complexity increases
Solution Approach 1:
The disruption patterns are pre-formed into the encapsulant material during the molding process itself, rather than requiring subsequent processing steps. The encapsulant is injected with built-in disruption patterns that automatically align with the mold gate, eliminating the need for separate alignment or processing operations.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a mold gate on an upper surface of the substrate; mounting an integrated circuit to the substrate; and forming an encapsulant encapsulating the integrated circuit, the encapsulant having disruption patterns emanating from the mold gate and underneath a bottom plane of the integrated circuit.