3D IC Packaging with Nested Conductive Frames
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges in simplifying manufacturing processes, reducing time to market, minimizing electrical components on circuit boards, and enhancing functionality while maintaining reliability and cost-effectiveness.
Innovation Solution
The proposed solution involves a method for integrated circuit packaging that includes a base circuit assembly with an integrated circuit device, pre-formed conductive frames having inner and outer interconnects of varying lengths, and an encapsulant applied over these interconnects, allowing for improved 3D packaging capabilities and reduced manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional integrated circuit packaging methods are used, then manufacturing processes are simplified, but packaging density and functionality are limited
Solution Approach 1:
The patent transitions from traditional 2D circuit board layouts to 3D stacked packaging architecture. Multiple integrated circuit devices are vertically stacked and interconnected through through-silicon vias (TSVs) and conductive structures, enabling higher packaging density while maintaining manufacturability through standardized stacking procedures
Solution Approach 2:
The patent implements nested packaging where smaller integrated circuit devices are positioned within or around larger device structures. The conductive frame and interconnect structures are nested within the stacked device architecture, allowing multiple functional layers to coexist in a compact volume
2Adaptability or versatility
If more electrical components are added to circuit boards to increase functionality, then product features improve, but circuit board size and complexity increase
Solution Approach 1:
The patent moves electrical connections from the planar circuit board domain to the vertical stacking domain. Through-silicon vias and vertical interconnect structures enable signal transmission between stacked devices, eliminating the need for extensive lateral routing on circuit boards and reducing overall board area
Solution Approach 2:
The patent combines multiple functional devices into a single stacked package unit. The conductive frame and interconnect structures serve multiple functions simultaneously: mechanical support, electrical interconnection, and signal routing, reducing the need for separate components on the circuit board
3Ease of manufacture
If conventional packaging structures are used, then manufacturing is easier, but reliability and connectivity are insufficient
Solution Approach 1:
The patent pre-forms conductive frames and interconnect structures before final device assembly. Through-silicon vias are pre-drilled and filled with conductive material, and conductive frames are pre-shaped with integrated connection points, enabling reliable connections while simplifying the final stacking and bonding processes
Solution Approach 2:
The patent employs composite interconnect structures combining different materials optimized for specific functions: copper or aluminum for high-conductivity electrical paths, dielectric materials for insulation, and conductive adhesives for mechanical bonding. This multi-material approach enhances both reliability and manufacturability
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a base circuit assembly having an integrated circuit device; mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect shorter than the outer interconnect over the base circuit assembly, the inner interconnect over the integrated circuit device and the outer interconnect around the integrated circuit device; applying an encapsulant over the inner interconnect and the outer interconnect; and removing a portion of the pre-formed conductive frame exposing an end of the inner interconnect and an end of the outer interconnect.