IC Packaging with Peripheral Lead Ridge and Central Heatsink
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges in reducing package dimensions, cost, and increasing functionality, particularly with Quad Flat No-Lead (QFN) packages experiencing long wire spans and complex bond layouts, leading to higher assembly costs and reliability issues.
Innovation Solution
The proposed solution involves a peripheral lead with a horizontal ridge and a conductive plate, a central lead, a top distribution layer connected to the integrated circuit, an insulation layer applied directly on the distribution layer and ridge, and a heatsink attached under the integrated circuit, which reduces wire span, package size, and costs while enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If traditional QFN packaging is used, then manufacturing process is simple, but wire span is long and bond layout is complex
Solution Approach 1:
The patent introduces a three-dimensional lead structure with vertical ridges and horizontal protrusions that extend in multiple dimensions. The peripheral lead includes a vertical ridge portion and a horizontal protrusion that creates a multi-level connection architecture, transforming the traditional planar two-dimensional layout into a three-dimensional structure. This dimensional change reduces wire span by providing closer connection points while simplifying bond layout through standardized vertical mounting surfaces.
2Volume of moving object
If package dimensions are reduced, then integration density increases, but manufacturing precision requirements increase
Solution Approach 1:
The lead structure is segmented into distinct functional portions: a vertical ridge portion, a horizontal protrusion, and a mounting surface. This segmentation allows each portion to be optimized independently for its specific function while maintaining overall compact dimensions. The standardized segmentation into reproducible geometric features enables precise manufacturing through modular tooling and process control, reducing the impact of size reduction on manufacturing precision requirements.
Solution Approach 2:
The patent specifies precise geometric parameters for the lead structure including ridge height, protrusion length, and mounting surface dimensions. By establishing standardized parameter ranges and tolerances, the design accommodates variations in manufacturing processes while maintaining functional performance. The parameter optimization balances compact package size with manufacturability through carefully selected dimensional relationships between different lead portions.
3Ease of manufacture
If insulation layer is applied directly on distribution layer and ridge, then assembly process is simplified, but electrical isolation reliability must be maintained
Solution Approach 1:
The patent combines the insulation layer application with the lead ridge structure by positioning the insulation directly on the horizontal protrusion and mounting surface areas. This merging of the insulation function with the existing lead geometry eliminates separate insulation structuring steps, simplifying the assembly process. The insulation material is selected and applied to ensure electrical isolation between adjacent leads while conforming to the three-dimensional lead surface, maintaining reliability through integrated design rather than additive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in reduced wire span, smaller package size, cost savings, improved reliability by eliminating lead pullouts and solder creep, and enhanced board level reliability (BLR) performance, exceeding 5% improvement compared to traditional QFN packages.
Implementation Method 1
a heatsink attached to the central lead under the integrated circuit
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming a peripheral lead having a peripheral lead bottom side, a peripheral lead top side, a peripheral lead non-horizontal side, a peripheral lead horizontal ridge, and a peripheral lead conductive plate, the peripheral lead horizontal ridge protruding from the peripheral lead non-horizontal side; forming a central lead adjacent to the peripheral lead; forming a first top distribution layer on the peripheral lead top side; connecting an integrated circuit to the first top distribution layer; applying an insulation layer directly on a bottom extent of the first top distribution layer and a peripheral lead ridge lower side of the peripheral lead horizontal ridge; and attaching a heatsink to the central lead under the integrated circuit.