Integrated Circuit Packaging with Peripheral Lead Ridge
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges in reducing package size, cost, and increasing functionality while maintaining reliability, particularly with Quad Flat No-Lead (QFN) packages experiencing long wire spans and complex bond layouts, leading to increased costs and assembly complexities.
Innovation Solution
The development of an integrated circuit packaging system featuring a peripheral lead with a horizontal ridge and conductive plate, a first top distribution layer with terminals, and an insulation layer applied to protect and isolate components, which reduces wire span, package size, and assembly complexity, while enhancing board-level reliability through improved connectivity and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If traditional QFN packaging is used, then manufacturing process is simple, but wire span is long and bond layout is complex
Solution Approach 1:
The patent introduces a third dimension by creating a raised ridge structure on the lead frame that extends vertically from the base plane. This dimensional change allows the distribution layer to be positioned at different heights, reducing the horizontal wire span required for connections while maintaining electrical connectivity. The ridge structure creates a stepped topology that shortens bond lengths without complicating the manufacturing process.
2Area of stationary object
If package size is reduced, then space utilization improves, but manufacturing precision requirements increase
Solution Approach 1:
The lead frame is segmented into distinct functional zones: a base plane for mechanical support, raised ridges for electrical connection, and recessed areas for component placement. The distribution layer is also segmented into regions that align with specific lead frame features. This segmentation allows each component to be manufactured and positioned independently with standard precision, while the overall integrated structure achieves compact dimensions.
3Reliability
If connectivity is improved, then board-level reliability increases, but assembly complexity increases
Solution Approach 1:
The distribution layer is pre-formed with connection points that directly align with the raised ridges of the lead frame before final assembly. This preliminary positioning ensures that when the integrated circuit is mounted, the wire bonds automatically connect to the correct pads without requiring complex alignment procedures. The pre-established geometric relationships simplify the assembly process while maintaining high connectivity reliability.
4Reliability
If protection layers are added, then component reliability improves, but manufacturing steps increase
Solution Approach 1:
The protective distribution layer is merged with the electrical connection function, creating a single integrated component that serves both purposes. Rather than adding a separate protection layer on top of existing connections, the distribution layer itself provides both electrical connectivity and mechanical/protection support. This consolidation reduces the number of discrete manufacturing steps while maintaining comprehensive component protection.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming a peripheral lead having a peripheral lead bottom side, a peripheral lead top side, a peripheral lead non-horizontal side, a peripheral lead horizontal ridge, and a peripheral lead conductive plate, the peripheral lead horizontal ridge protruding from the peripheral lead non-horizontal side; forming a first top distribution layer on the peripheral lead top side, the first top distribution layer having a first top terminal; connecting an integrated circuit to the first top distribution layer, the integrated circuit having a central portion directly over a plurality of the first top terminal; and applying an insulation layer directly on a bottom extent of the first top distribution layer and a peripheral lead ridge lower side of the peripheral lead horizontal ridge.