IC Packaging Redistrib Layer Vertical Offset Interconnect
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Solution Overview
Problem
The challenge in integrated circuit packaging is to create reliable and efficient manufacturing processes for smaller, thinner components with more functions and connections, as existing solutions have not effectively addressed the issue of damaged connectors during testing, leading to reduced reliability and yield.
Innovation Solution
The method involves forming a peripheral interconnect with a bond finger and contact pad, where the bond finger is vertically offset from the contact pad, and a trace connects them, allowing for direct contact and exposure during module encapsulation, enabling reliable testing and connection without damaging the contact pad or bond finger.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If packages and connectors are made smaller to meet product demands, then portability and device size are improved, but connector reliability and resistance to damage during testing deteriorate
Solution Approach 1:
The interconnect structure is segmented into distinct functional zones: a bond finger region for connection, a contact pad region for testing, and a trace connecting them. This segmentation allows the bond finger to be positioned vertically offset from the contact pad, creating spatial separation that prevents damage to the contact pad during bonding operations while maintaining electrical connectivity through the trace.
Solution Approach 2:
The bond finger is positioned in a different vertical dimension (z-height) than the contact pad, creating a three-dimensional configuration. This vertical offset allows the bond finger to extend to a different elevation than the contact pad plane, enabling reliable bonding operations without damaging the contact pad during testing, thus resolving the contradiction between small size and connector reliability.
2Manufacturing precision
If testing is performed on small connectors, then manufacturing quality control is improved, but the connectors are more likely to be damaged
Solution Approach 1:
The interconnect is divided into separate testing and bonding zones. The contact pad is dedicated to testing operations and is spatially separated from the bond finger through vertical offset. This segmentation allows testing to be performed on the contact pad without risking damage to the bond finger or other connectors, as the testing probe engages only the contact pad at a different z-height.
Solution Approach 2:
The trace acts as an intermediary element that electrically connects the bond finger and contact pad while allowing them to be positioned at different vertical levels. This intermediary structure enables the contact pad to be used for testing without directly involving the bond finger, thus preventing damage to the bond finger during testing operations while maintaining electrical continuity.
3Ease of manufacture
If bond finger and contact pad are at the same level, then manufacturing process is simpler, but testing may damage the bond finger or connection
Solution Approach 1:
The bond finger and contact pad are positioned at different vertical levels (z-heights) rather than the same plane. This three-dimensional arrangement allows testing probes to engage the contact pad without risking damage to the bond finger or the connection between them. The vertical offset creates sufficient clearance to perform testing operations safely while maintaining electrical connectivity through the trace.
Solution Approach 2:
The interconnect structure is segmented into vertically separated functional regions: the bond finger at one z-height for connection purposes, and the contact pad at a different z-height for testing purposes. This segmentation allows each element to perform its specific function without interfering with or damaging the other, resolving the contradiction between manufacturing simplicity and connection integrity.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming a peripheral interconnect having a bond finger and a contact pad with a trace in direct contact with the bond finger and the contact pad, the bond finger vertically offset from the contact pad; connecting an integrated circuit die and the bond finger; and forming a module encapsulation on the integrated circuit die, the bond finger and the trace exposed from the module encapsulation.