Integrated Circuit Packaging With Segmented Leads For 3D Stacking
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Solution Overview
Problem
The challenge is to develop an integrated circuit packaging system that achieves miniaturization, increased density, and reduced costs while addressing the limitations of existing technologies in providing integration, space savings, and low-cost manufacturing for portable electronic devices.
Innovation Solution
The system involves forming leads with a horizontally contiguous structure, a top conductive layer having a protrusion and non-vertical portion, connecting an integrated circuit to the protrusion, and encapsulating it to expose the top non-vertical upper side, enabling 3D package integration and efficient stacking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If integrated circuits are stacked into a single package to increase density, then packaging density is improved, but device complexity increases
Solution Approach 1:
The lead structure is segmented into multiple functional portions: a bottom body portion for mechanical support, a vertical portion for electrical connection, and a top non-vertical portion for additional connectivity. This segmentation allows each portion to serve its specific function optimally while contributing to the overall goal of increased packaging density without proportionally increasing complexity.
Solution Approach 2:
The lead structure transitions from a conventional two-dimensional planar layout to a three-dimensional structure with vertical and non-vertical portions. This dimensional change enables multiple integrated circuits to be stacked vertically within the same footprint, significantly increasing packaging density while the modular lead design keeps the added complexity manageable.
2Adaptability or versatility
If the lead structure is made more complex to provide additional attachment sites, then integration capability is improved, but manufacturing precision requirements increase
Solution Approach 1:
Different portions of the lead structure have different geometries optimized for their specific functions: the bottom body portion provides mechanical strength, the vertical portion provides reliable electrical connection, and the top non-vertical portion provides additional attachment sites. This local optimization of structure quality allows the lead to provide versatile integration capability without requiring uniformly high manufacturing precision across the entire structure.
3Volume of moving object
If the package size is reduced to improve portability, then device size is improved, but packaging density decreases
Solution Approach 1:
The lead structure utilizes three-dimensional space with vertical and non-vertical portions to provide multiple attachment sites within a compact footprint. This enables multiple integrated circuits to be stacked vertically in the same horizontal space, effectively increasing packaging density while maintaining or reducing the overall package size for improved portability.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming a lead having a lead bottom body, a lead top body, and a lead top conductive layer directly on the lead top body, the lead top conductive layer having a top protrusion and a top non-vertical portion, the lead bottom body having a horizontally contiguous structure; connecting an integrated circuit to the top protrusion; and forming an encapsulation covering the integrated circuit and exposing a top non-vertical upper side of the top non-vertical portion.