IC Packaging with Shielded Rounded Interconnects
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Solution Overview
Problem
Integrated circuit packaging systems face challenges in achieving high input/output density, low cost, and improved reliability due to increased miniaturization and functionality integration, with existing solutions failing to effectively address these needs.
Innovation Solution
The system involves mounting an integrated circuit over a package carrier with a rounded interconnect and a conductive shield having an elevated portion and a hole, where the rounded interconnect is exposed from the hole, and forming an encapsulation between the conductive shield and the package carrier, which enhances electrical connectivity, shields against electromagnetic interference, and improves structural rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If increased miniaturization and packaging density are implemented, then component size and product thickness are reduced, but reliability and assembly defect rates deteriorate
Solution Approach 1:
The conductive shield with elevated portion and hole is pre-configured before encapsulation to define the exact exposure location of rounded interconnects. This preliminary structuring ensures precise encapsulation formation that exposes only intended interconnects while maintaining package integrity, thereby improving assembly reliability despite miniaturization
Solution Approach 2:
The conductive shield acts as an intermediary structure between the rounded interconnects and the encapsulation material. It controls which interconnects are exposed through its hole configuration, enabling precise electrical connectivity control while protecting other interconnects during assembly, thus resolving the reliability issue in miniaturized packages
2Quantity of substance
If high input/output density is achieved through increased interconnect exposure, then electrical connectivity is improved, but electromagnetic interference increases
Solution Approach 1:
The conductive shield provides localized electromagnetic shielding by selectively covering certain rounded interconnects while leaving others exposed through its hole. This local quality approach allows high I/O density through multiple exposed interconnects while simultaneously providing EMI protection to specific sensitive interconnects, resolving the contradiction between connectivity and interference
3Strength
If encapsulation is formed to protect rounded interconnects, then structural integrity is improved, but electrical connectivity to external circuits deteriorates
Solution Approach 1:
The conductive shield extracts or removes specific portions (holes) from the encapsulation structure to expose selected rounded interconnects. This allows the encapsulation to provide overall structural protection while maintaining electrical connectivity pathways to external circuits through the exposed interconnects, resolving the contradiction between protection and connectivity
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; mounting a rounded interconnect on the package carrier; mounting a conductive shield over the package carrier, the conductive shield having an elevated portion and a hole adjacent to the elevated portion with the elevated portion over the integrated circuit and the rounded interconnect exposed from the hole; and forming an encapsulation between the conductive shield and the package carrier with the rounded interconnect exposed.