Integrated Circuit Packaging with Stacked Substrates and Variable Connector Pitch
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current integrated circuit packaging systems fail to achieve high density, low cost, and improved performance, particularly in portable electronic devices, as they do not adequately address the need for increased integration and cost reduction while maintaining competitive pressures and consumer expectations.
Innovation Solution
The proposed solution involves a method of integrated circuit packaging that includes a base substrate, a stack substrate with inter-substrate connectors, an integrated circuit with internal connectors, and external connectors on the base substrate, where the external connector pitch is greater than the inter-substrate connector pitch, allowing for reduced package size and cost while maintaining signal integrity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If packaging density is increased to reduce device size, then device portability is improved, but manufacturing complexity increases
Solution Approach 1:
The packaging system is divided into multiple substrates (first substrate, second substrate, third substrate) that are stacked vertically. Each substrate handles specific functions and connector types, allowing complex packaging requirements to be segmented into manageable layers with specialized roles.
Solution Approach 2:
The patent transitions from a planar two-dimensional packaging layout to a three-dimensional vertical stacking architecture. By arranging substrates and connectors in the vertical dimension (Z-axis), the system achieves higher packaging density without increasing the horizontal footprint, thereby improving portability while managing complexity through spatial reorganization.
2Adaptability or versatility
If more integrated circuits are integrated into a package to increase content, then functional integration is improved, but cost reduction becomes more difficult
Solution Approach 1:
The patent employs multiple types of connectors (internal connectors, inter-substrate connectors, external connectors) that can serve different functions within the same packaging system. These connectors enable the package to integrate various IC functions while maintaining standardized manufacturing processes, thus achieving high integration without proportionally increasing manufacturing cost.
Solution Approach 2:
The packaging structure implements a nested arrangement where the second substrate is positioned over the first substrate, and the third substrate is positioned over the second substrate. This nested doll-like stacking allows multiple IC components to be integrated in a compact vertical arrangement, increasing functional integration while optimizing space utilization and manufacturing efficiency.
3Quantity of substance
If connector pitch is reduced to increase density, then packaging density is improved, but signal integrity may deteriorate
Solution Approach 1:
The patent applies different connector pitch values at different locations and levels within the packaging system. The first, second, and third substrates can have different pitch configurations optimized for their specific functions and signal requirements. This local quality approach allows high density where needed while maintaining signal integrity where performance is critical.
Solution Approach 2:
The system utilizes varying connector pitch parameters across different substrate layers and connector types. By changing the pitch parameter locally rather than uniformly throughout the package, the design achieves overall high density while maintaining adequate signal integrity for critical connections. The pitch can be adjusted based on signal frequency, length, and routing requirements.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a stack substrate over the base substrate with an inter-substrate connector directly on the stack substrate and the base substrate, the inter-substrate connector having an inter-substrate connector pitch; mounting an integrated circuit over the stack substrate, the integrated circuit having an internal connector directly on the stack substrate; and attaching an external connector directly on the base substrate, the external connector having an external connector pitch greater than the inter-substrate connector pitch.