IC Packaging Stiffener Opening for Thermal and Structural Management
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Solution Overview
Problem
The challenge is to develop an integrated circuit packaging system that achieves miniaturization, increased density, and reduced costs while maintaining reliability and performance, particularly for portable electronic devices, as existing technologies fail to fully address integration, space savings, and cost reduction effectively.
Innovation Solution
The system involves a substrate with a stiffener having a complete opening, encapsulation molded on the substrate and stiffener, an integrated circuit mounted within the stiffener's perimeter, and a lid plate attached to the stiffener's inner upper periphery, enhancing structural integrity and electromagnetic shielding while allowing for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the integrated circuit package is miniaturized to reduce size and thickness, then portability is improved, but structural stability and rigidity deteriorate
Solution Approach 1:
The package is divided into distinct functional regions: a substrate region, a stiffener region with opening, an encapsulation region, and a lid plate region. This segmentation allows each component to be optimized independently - the stiffener provides structural support while the opening area can be utilized for heat dissipation or electrical shielding, maintaining stability in the miniaturized package
Solution Approach 2:
The package employs composite construction with a substrate, a stiffener (potentially different material properties), an encapsulation material, and a lid plate. This composite structure enables the miniaturized package to achieve enhanced mechanical strength and rigidity through material synergies, counteracting the stability loss from reduced size
2Quantity of substance
If more integrated circuits are integrated into a single package to increase density, then space savings are achieved, but manufacturing complexity increases
Solution Approach 1:
The stiffener with its opening serves multiple functions simultaneously: it provides structural reinforcement to the substrate, defines a region for the integrated circuit, enables heat dissipation pathways, and can provide electromagnetic shielding. This multi-functionality reduces the need for additional separate components, simplifying the overall package structure despite high circuit density
Solution Approach 2:
The package structure exhibits nested arrangements where the integrated circuit is mounted within the perimeter defined by the stiffener opening, the encapsulation surrounds and protects the circuit, and the lid plate covers the assembly. This nested configuration maximizes space utilization for high density while maintaining a hierarchical structure that simplifies manufacturing processes
3Length of stationary object
If the package is made thinner to reduce product thickness, then portability is improved, but thermal dissipation capability deteriorates
Solution Approach 1:
The stiffener opening creates a localized region with different thermal properties compared to the solid stiffener areas. This opening can serve as a thermal pathway or vent, allowing heat to escape from the integrated circuit region. The local modification of the stiffener structure enables effective heat dissipation despite the overall thin package thickness
Solution Approach 2:
Instead of relying solely on vertical heat dissipation pathways (thickness direction), the stiffener opening provides additional thermal management options in the horizontal plane. Heat can be dissipated through the opening area or conducted through the stiffener's lateral structures, adding dimensional flexibility to thermal management in the thin package
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a stiffener, having a stiffener opening completely through the stiffener, on the substrate; molding an encapsulation on the substrate and directly on an outer upper periphery surface of the stiffener and exposing an inner upper periphery surface of the stiffener, the encapsulation exposing a portion of the substrate; mounting an integrated circuit over the substrate and within the perimeter of the stiffener; and attaching a lid plate on the inner upper periphery surface of the stiffener and over the integrated circuit, the lid plate extending above an encapsulation top side.