IC Packaging Encapsulant Containment via Non-Vertical Strip Patterns
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Solution Overview
Problem
The challenge lies in manufacturing high-density, high-performance integrated circuit packages that are smaller in size, more reliable, and cost-effective, while ensuring easy integration with automated machinery and minimizing manufacturing scrap and rework, as existing solutions have not adequately addressed these needs.
Innovation Solution
The solution involves creating an integrated circuit packaging system with a substrate featuring non-horizontal and non-vertical strip patterns, which restricts the encapsulation material from reaching the edge of the substrate, preventing mold flash and enhancing yield and reliability by using a grid or mesh pattern of non-conductive material, such as solder resist, to vent and direct excess encapsulant material effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If encapsulation material is applied over the integrated circuit device, then the device is protected and sealed, but mold flash forms at the substrate edge causing defects and rework
Solution Approach 1:
The patent applies a release agent to the substrate edge before applying encapsulation material. This preliminary action prevents the encapsulation material from adhering to the substrate edge, thereby preventing mold flash formation while maintaining device protection. The release agent creates a barrier that stops the material from spreading beyond the intended area.
Solution Approach 2:
The release agent acts as an intermediary substance between the encapsulation material and the substrate edge. It mediates the interaction by providing a surface that the encapsulation material cannot bond to, thus preventing mold flash while allowing the encapsulation to properly seal and protect the device.
2Volume of moving object
If smaller package size is achieved for high density integration, then product size is reduced, but manufacturing complexity and difficulty of automated assembly increase
Solution Approach 1:
The patent segments the substrate surface by creating distinct functional zones: an active area for device mounting, a release agent application zone at the edge, and a transition zone between them. This segmentation allows different processes to occur in dedicated areas, simplifying manufacturing despite the small overall package size.
Solution Approach 2:
The patent applies different properties to different parts of the substrate. The edge region receives a release agent coating with specific adhesive properties, while the active mounting area maintains its original surface characteristics. This local differentiation enables precise control of encapsulation material flow and adhesion in specific zones without affecting the entire substrate.
3Productivity
If increased manufacturing throughput is implemented, then productivity improves, but quality control and defect reduction become more challenging
Solution Approach 1:
The release agent system is designed to be self-regulating. The encapsulation material naturally stops at the substrate edge where the release agent is applied, without requiring additional active control mechanisms. This self-service approach maintains consistent quality across high-volume production runs by relying on the inherent properties of the release agent rather than complex real-time control systems.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming layers having non-horizontal strip patterns and non-vertical strip patterns over the substrate; mounting an integrated circuit device on the substrate adjacent the non-horizontal strip patterns and the non-vertical strip patterns; and applying an encapsulation over the integrated circuit device, the encapsulation restricted by the layers to prevent the encapsulation from reaching an edge of the substrate.