IC Packaging with Vertical Insertion Cavities and Rounded Interconnects
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Solution Overview
Problem
There is a growing need for smaller, high-density integrated circuit packages with increased electrical connections and precision in packaging to meet the demands of lightweight, multi-functional electronic products, while also reducing costs and improving reliability and product yields under competitive pressures.
Innovation Solution
The method involves providing a substrate with a component connector, forming a resist layer with vertical insertion cavities orthogonal to the substrate, and creating rounded interconnects within these cavities that are nonconformal to the cavities, allowing for high-density electrical connectivity and reduced structural stress, along with mounting an integrated circuit device on the component connector.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If package size is reduced to meet lightweight and smaller product demands, then product size and weight are improved, but the number of electrical connections that can be accommodated deteriorates
Solution Approach 1:
The patent transitions from planar electrical connections to three-dimensional vertical insertion cavities. The rounded interconnects extend vertically through the substrate thickness, enabling multiple connection points within a compact footprint area, thus increasing connection density without increasing package planar dimensions.
Solution Approach 2:
The rounded interconnects are nested within the vertical insertion cavities formed in the substrate. This nesting arrangement allows the electrical connections to be contained within the substrate volume rather than requiring additional external space, enabling high connection density in a small package.
2Quantity of substance
If the number of package connectors is increased to support more electrical connections, then electrical connectivity is improved, but device complexity and manufacturing difficulty worsen
Solution Approach 1:
The substrate is segmented into multiple vertical insertion cavities, each accommodating a rounded interconnect. This segmentation allows independent formation and testing of each connection point, simplifying the manufacturing process for high-density connections compared to creating complex integrated connector structures.
Solution Approach 2:
Rounded interconnects with spherical or spheroidal shapes are used instead of complex angular connector geometries. The curved surfaces simplify manufacturing processes such as deposition and bonding, while the uniform shape facilitates automated placement and reduces sensitivity to alignment variations.
3Reliability
If electrical connections are placed with higher precision to ensure proper spacing, then connection reliability is improved, but manufacturing complexity and cost worsen
Solution Approach 1:
Vertical insertion cavities are pre-formed in the substrate before the rounded interconnects are attached. This preliminary structuring establishes precise spatial positions for each connection point, ensuring proper spacing and alignment is achieved during the substrate fabrication process rather than requiring complex alignment procedures during final assembly.
Solution Approach 2:
The rounded interconnects self-align within the vertical insertion cavities during the bonding process. The cavity geometry guides the interconnect placement, providing automatic positioning that ensures precise spacing without requiring complex external alignment fixtures or procedures.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a component connector on the substrate; forming a resist layer on the substrate with the component connector exposed; forming a vertical insertion cavity in the resist layer, the vertical insertion cavity isolated from the component connector or a further vertical insertion cavity, the vertical insertion cavity having a cavity side that is orthogonal to the substrate; forming a rounded interconnect in the vertical insertion cavity, the rounded interconnect nonconformal to the vertical insertion cavity; and mounting an integrated circuit device on the component connector.