Integrated Circuit Packaging Via Structures and Barrier Liners
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Solution Overview
Problem
Conventional semiconductor package structures face challenges in miniaturization, reliability, and cost-effectiveness, particularly in portable devices, where they require smaller, thinner, and more densely packed integrated circuits with improved performance and lower manufacturing costs.
Innovation Solution
The method involves creating an integrated circuit packaging system with a substrate having a recess and via structures, including a barrier liner and multiple vias that extend beyond the non-active side, providing a robust connection and shielding for improved reliability and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor package structures are used, then manufacturing is simpler and cost is lower, but miniaturization and packaging density are limited
Solution Approach 1:
The patent implements package-on-package (POP) architecture where multiple integrated circuit packages are stacked vertically, with upper packages nested within or upon lower packages. This nesting approach achieves miniaturization by utilizing the vertical dimension, reducing the horizontal footprint while maintaining multiple functional layers within a compact volume.
Solution Approach 2:
The invention transitions from conventional two-dimensional planar packaging to three-dimensional vertical stacking. By extending the packaging architecture into the vertical dimension with multiple stacked layers connected through via structures, the system achieves higher packaging density without increasing the lateral package dimensions.
2Reliability
If package-on-package (POP) design is used to increase density, then packaging density improves, but reliability challenges and cost increase
Solution Approach 1:
The patent forms barrier liners and via structures during the semiconductor fabrication process before final packaging, rather than attempting to create these connections after packages are assembled. This preliminary formation ensures precise alignment and robust electrical connections between stacked packages, addressing reliability challenges of POP designs.
Solution Approach 2:
The invention introduces barrier liners as intermediary structures within via holes to enable reliable electrical connections between different package layers. These barrier liners prevent diffusion and ensure stable conductive pathways, solving the reliability issues inherent in multi-layer POP configurations.
3Length of moving object
If miniaturization is pursued to reduce device size, then device dimensions decrease, but manufacturing precision requirements increase
Solution Approach 1:
The patent establishes via structures, barrier liners, and conductive pathways during the semiconductor wafer fabrication process before dicing and packaging. This preliminary formation ensures that alignment features are built-in with high precision, eliminating the need for post-dicing alignment operations and maintaining manufacturing precision despite device miniaturization.
4Reliability
If conventional molding approaches are used, then manufacturing is simpler, but signal integrity and high-frequency performance deteriorate
Solution Approach 1:
The via structures and barrier liners serve multiple functions simultaneously: providing electrical connectivity between layers, offering electromagnetic shielding, and maintaining signal integrity. This multi-functionality addresses signal integrity and high-frequency performance requirements without requiring separate dedicated shielding structures.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit substrate having a non-active side and an active side; forming a recess in the integrated circuit substrate from the non-active side exposing a first contact and a second contact with the first contact and the second contact along the active side; forming a first via, having a first via extension extended beyond the non-active side and an opening at the non-active side, within the recess; forming a barrier liner within the opening with the barrier liner exposed beyond the non-active side; and forming a second via over the barrier liner and within the opening of the first via with the second via exposed beyond the non-active side.