IC Pad Connection Error Detection via Dynamic Switching

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing integrated circuit testing methods fail to accurately determine connection errors between bonding option pads and external voltage supplies, leading to incorrect identification of defective chips and fixed power consumption, which is undesirable in mobile devices.

Innovation Solution

An integrated circuit chip with a pad, first and second resistors, and switches connected to different reference voltages, controlled by a controller to selectively turn on/off switches and generate test results, allowing for accurate determination of connection errors with low power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a resistor is fixedly connected between the pad and internal voltage supply/ground to prevent floating state, then connection error detection capability is improved, but power consumption increases during normal operation

Engineering Contradiction:

Improveconnection error detection capabilityVSAvoidpower consumption

Core Design Contradiction:

ReliabilityVSUse of energy by moving object

Solution Approach 1:

The patent applies the dynamics principle by making the resistor connection dynamic rather than fixed. The switch controlled by the controller enables the resistor to be connected to the pad only during testing phases and disconnected during normal operation. This dynamic switching mechanism allows the system to maintain reliable connection error detection capability when needed while eliminating unnecessary power consumption during normal chip operation.

Inventive Principle:

Principle #15Dynamics

2Reliability

If a resistor is fixedly connected to prevent floating state, then voltage level maintenance is improved, but testing accuracy for bonding wire disengagement deteriorates

Engineering Contradiction:

Improvevoltage level maintenanceVSAvoidtesting accuracy for bonding wire disengagement

Core Design Contradiction:

ReliabilityVSMeasurement precision

Solution Approach 1:

The patent implements periodic action by alternating between testing mode and normal operation mode. During testing mode, the switch connects the resistor to the pad to maintain voltage levels for accurate error detection. During normal operation, the switch disconnects the resistor. This periodic switching enables both functions: accurate testing when required and proper operational behavior when the bonding wire is correctly connected.

Inventive Principle:

Principle #19Periodic action

Solution Approach 2:

The dynamic switching mechanism allows the system to adapt its behavior based on operational phase. The controller activates the switch during testing to enable voltage maintenance for accurate measurement, and deactivates it during normal operation. This dynamic control resolves the contradiction by making the resistor connection conditional rather than permanent.

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS8803544B2Integrated circuit chip and testing method capable of detecting connection error

Publication Date: 2014.08.12 MEDIATEK INC

AI summary

An integrated circuit chip is provided. The integrated circuit chip includes a pad, a first resistor, a second resistor, a first switch, a second switch and a controller. The first resistor and the first switch are serially connected between the pad and a first reference voltage terminal. The second resistor and the second switch are serially connected between the pad and a second reference voltage terminal. The controller selectively turns on and off the first and second switches according to an error determining mechanism. The error determining mechanism determines whether an error condition associated with the pad is present.