Integrated Circuit Passivation Layer for Stable Electrical Connections
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Solution Overview
Problem
In display devices, the use of anisotropic conductive films for electrical connections between substrates and integrated circuits can lead to short circuit defects and resistance differences due to irregular distribution and aggregation of conductive particles, especially as display resolution increases.
Innovation Solution
An integrated circuit design featuring a substrate with a pad electrode, a passivation layer made of organic insulating material, and a bump electrode connected through a contact hole, where the passivation layer has varying thicknesses and a semicircular cross-section, preventing short circuits and ensuring stable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of conductive particles is increased to prevent reduction in conductivity, then conductivity is maintained, but short circuit defects occur due to aggregation of conductive particles
Solution Approach 1:
A non-conductive film is introduced as an intermediary layer between adjacent pad portions to prevent direct contact and aggregation of conductive particles. This mediator layer physically separates the conductive particles while still allowing electrical connection through the ACF, thus maintaining conductivity while preventing short circuit defects caused by particle aggregation
2Reliability
If conductive particles are used for electrical connection, then electrical connectivity is achieved, but resistance differences occur due to irregular distribution of conductive particles
Solution Approach 1:
The non-conductive film is selectively applied only in specific regions between adjacent pad portions where particle aggregation is most likely to occur. This local quality approach allows uniform resistance characteristics in critical areas while maintaining overall electrical connectivity, addressing the resistance uniformity issue without compromising the electrical connection function
Data Source
AI summary
An integrated circuit includes a substrate, a pad electrode disposed on the substrate, and a passivation layer disposed on the pad electrode and including an organic insulating material. The integrated circuit further includes a bump electrode disposed on the passivation layer and connected to the pad electrode through a contact hole. The passivation layer includes an insulating portion having a first thickness and covering an adjacent edge region of the pad electrode and the substrate, and a bump portion having a second thickness, that is greater than the first thickness, and covering a center portion of the pad electrode.