Concurrent IC Pin and Component Placement Optimization
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Solution Overview
Problem
Conventional Electronic Design Automation (EDA) tools for integrated circuit (IC) design face limitations in component placement, particularly with pre-fixed input/output (IO) pin locations, which restrict downstream placement processes and result in inferior design quality and timing violations due to split modules.
Innovation Solution
The development of improved EDA tools that concurrently place IO pins and internal components, allowing for flexible placement constraints and iterative optimization to ensure that IO pins obey these constraints, thereby enhancing the overall IC design flow and quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If IO pins are placed at pre-fixed locations before internal components, then the placement process is simpler and more structured, but the downstream placement optimization is severely restricted and design quality deteriorates
Solution Approach 1:
The patent applies preliminary action by performing a preliminary placement of IO pins at pre-fixed locations to establish a structured placement process framework. This preliminary structure enables subsequent optimization algorithms to work systematically while still achieving high-quality results through iterative improvement.
Solution Approach 2:
The patent applies dynamics by transitioning from static pre-fixed IO pin locations to dynamic placement optimization. The downstream placement optimization algorithm dynamically adjusts component positions based on design requirements, transforming the rigid pre-fixed structure into a flexible optimization process that improves design quality.
2Ease of manufacture
If IO pins are placed at pre-fixed locations, then the placement process is more organized, but split modules occur causing timing violations and design convergence delays
Solution Approach 1:
The patent applies feedback by implementing iterative optimization that continuously monitors placement quality metrics including timing performance. The optimization algorithm receives feedback about split modules and timing violations, then adjusts IO pin and component placements to eliminate these issues while maintaining organizational structure.
Solution Approach 2:
The patent applies preliminary action by establishing an organized placement framework with pre-fixed IO pin locations that groups related pins together. This preliminary organization prevents split modules by ensuring IO pins connected to the same module are placed on the same boundary edge, thereby preventing timing violations before optimization begins.
3Ease of manufacture
If IO pins are placed at pre-fixed locations, then the initial placement is more systematic, but the overall wirelength increases and negative slacks multiply
Solution Approach 1:
The patent applies dynamics by enabling the placement system to transition from static pre-fixed IO pin locations to dynamic optimization. The placement optimization algorithm dynamically repositions components and adjusts wire routing to minimize overall wirelength and reduce negative slacks while maintaining the systematic organization established by pre-fixed locations.
Data Source
AI summary
Embodiments disclosed herein describe systems, methods, and products for concurrently placing and optimizing input-output (IO) pins and internal components of an integrated circuit (IC) design. In an illustrative process flow, the computer (executing an illustrative EDA tool) may import the IC design and unplace the IO pins of the imported IC design. The computer may set one or more constraints for the IO pins with more degrees of freedom than the conventional pre-fixed locations. The computer may then concurrently place the IO pins and the internal components such that the IO pins obey the one or more constraints. The computer may iteratively optimize the placement of the IO pins and the internal components while ensuring that the one or more constraints are not violated.