IC Package Pin Sensing for External RLC and Parasitic Detection
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Solution Overview
Problem
Existing integrated circuit (IC) packages face challenges in detecting external component parameters and parasitics efficiently, leading to suboptimal performance and increased design complexity, as traditional methods require additional sensing pins and are not reliable for measuring passive components.
Innovation Solution
An integrated circuit package with internal detection circuitry, including resistance, inductance, and capacitance detectors, that uses a pin to detect external component parameters and parasitics without extra sensing pins, allowing for adaptive configuration based on detected values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional sensing pins are used to detect external component parameters, then measurement capability is provided, but device complexity and pin count increase
Solution Approach 1:
The existing I/O pin is made multi-functional by enabling it to perform both its traditional input/output function and an additional function of serving as a sensing pin for detecting external component parameters. This eliminates the need for dedicated sensing pins while maintaining measurement capability.
Solution Approach 2:
The detection function is merged with the existing I/O pin structure and control logic. The same pin that handles data input/output is combined with parameter sensing capability, reducing overall device complexity while providing comprehensive functionality.
2Measurement precision
If traditional external sensing methods are used, then component parameters can be measured, but testing and calibration time increases
Solution Approach 1:
The IC package performs self-characterization by automatically detecting its own external component parameters and parasitics through integrated detection circuitry. This eliminates the need for external testing equipment and manual calibration processes, significantly reducing testing and calibration time.
Solution Approach 2:
The detection circuitry automatically characterizes external components during the initialization or power-up phase before the IC begins normal operation. This preliminary detection ensures accurate parameter knowledge is available immediately when needed, eliminating subsequent calibration steps.
3Ease of manufacture
If fixed configuration IC packages are used, then manufacturing is simplified, but adaptability to different external components is reduced
Solution Approach 1:
The IC package transitions from a fixed configuration to a dynamic, adaptive configuration. The detection circuitry continuously monitors external component parameters and allows the IC to adjust its operating characteristics accordingly, enabling the same manufactured IC to adapt to various external component variations.
Solution Approach 2:
The IC package uses detected parameter information to dynamically change its operational parameters such as drive strength, timing, or voltage levels. This allows a single manufactured IC design to optimize its performance across different external component conditions without requiring multiple fixed configuration variants.
Data Source
AI summary
Apparatus and techniques for an integrated circuit (IC) package to automatically detect, through an input/out pin, external component parameters and parasitics. An example IC package generally includes a pin for coupling to a component external to the IC package, and at least one of a resistance detector, an inductance detector, or a capacitance detector coupled to the pin, and configured to detect at least one of a resistance, an inductance, or a capacitance, respectively, of a lumped parameter model for the component external to the IC package. The resistance detector, inductance detector, or capacitance detector may also be configured to detect parasitics associated with at least one of the component, the pin, or a connection between the component and the pin.