Positioning frame structure
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Solution Overview
Problem
Existing positioning methods for integrated chips (ICs) require adhesives and are not suitable for smaller ICs, as they rely on magnets smaller than the IC, making centering and positioning complex and costly.
Innovation Solution
A positioning frame structure with an IC carrier and holder that allows a larger positioning magnet, eliminating the need for adhesives and enabling precise centering and positioning of smaller ICs by using a chamber and holder design that secures the IC without adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the magnet size is made smaller than the IC size to enable centering, then centering can be performed, but the IC must be secured by adhesive which increases cost and complexity
Solution Approach 1:
The patent inverts the conventional approach by making the magnet larger than the IC rather than smaller. This reversal allows the magnet to serve as the reference object for centering, with the IC positioned on top of it. The IC holder with positioning protrusions engages with positioning recesses on the magnet, enabling precise centering without requiring the magnet to be smaller than the IC.
Solution Approach 2:
The IC holder acts as an intermediary component between the IC and the magnet. It provides positioning protrusions that engage with positioning recesses on the magnet, transferring and maintaining the precise relative position between the IC and magnet. This intermediary structure eliminates the need for adhesive while ensuring accurate positioning.
2Reliability
If adhesive is used to secure the IC, then the IC can be fixed on the carrier, but production cost increases
Solution Approach 1:
The patent replaces the chemical bonding method (adhesive) with a mechanical positioning system. The IC holder with positioning protrusions mechanically engages with positioning recesses on the magnet, providing reliable fixation through physical interlocking rather than chemical adhesion. This mechanical system eliminates the need for adhesive materials and associated production costs.
Solution Approach 2:
The positioning structure is designed to be self-fixing through the engagement of positioning protrusions and recesses. The IC holder and magnet automatically maintain their relative positions through this mechanical interlocking mechanism, eliminating the need for external adhesive application processes and reducing manufacturing complexity.
3Manufacturing precision
If the magnet size is made smaller than the IC size, then centering can be achieved, but the solution is not suitable for smaller ICs
Solution Approach 1:
The patent creates a universal positioning system where the magnet is larger than the IC, allowing the same magnet design to accommodate different IC sizes. The IC holder with positioning protrusions can adapt to various IC dimensions while maintaining precise centering on the larger magnet surface, making the system versatile for different IC form factors.
Data Source
AI summary
A positioning frame structure for the centering and positioning of an IC is disclosed, in which the positioning frame structure comprises an IC carrier having a first chamber defined therein and an IC positioning magnet disposed in the first chamber of the IC carrier. The positioning frame structure further comprises an IC holder disposed over the IC positioning magnet, and the IC is held on the IC holder, so as to provide centering and positioning of the IC relative to the IC positioning magnet. The present invention can be used to control the centering and positioning of the IC and the positioning magnet on the carrier. The positioning magnet can be made to be larger than the IC. In addition, a large air gap can be obtained so as to facilitate the subsequent operation of the IC. Furthermore, without the operation using adhesive, the technical solution of the present invention saves the cost of operation.