IC Protective Layer Stack for Moisture-Resistant Pad Openings
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Solution Overview
Problem
The issue of delamination between overlying protective and underlying dielectric layers in semiconductor manufacturing due to moisture penetration is addressed.
Innovation Solution
A multi-layer protective structure is implemented, where the uppermost protective layer covers the interfaces between underlying layers, blocking moisture penetration paths and reducing delamination, comprising a first protective layer, a second protective layer, and optionally a third protective layer, all made of polymer materials such as epoxy or polyimide, with specific patterning to expose conductive pads and layers for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single protective layer is used, then the manufacturing process is simple, but moisture penetration causes delamination between layers
Solution Approach 1:
The protective layer is divided into multiple segments (first protective layer, second protective layer, and third protective layer) stacked in sequence. Each layer serves as a separate barrier against moisture penetration, preventing delamination by distributing the protective function across multiple independent layers rather than relying on a single layer.
Solution Approach 2:
The patent employs composite protective structures where multiple protective layers are combined with different materials and configurations. The first protective layer, second protective layer, and third protective layer form a composite barrier system that enhances overall moisture resistance and prevents interfacial delamination through material diversity and structural complexity.
2Reliability
If protective layers completely cover underlying structures, then moisture protection is maximized, but electrical connections to conductive pads become difficult
Solution Approach 1:
The protective layers are designed with spatially varying properties: they completely cover the underlying dielectric layers for maximum moisture protection, but include localized openings or exposed regions at specific positions where conductive pads are located. This allows electrical connections to be made through the protective structure without compromising overall moisture barrier integrity.
Solution Approach 2:
The protective layers act as an intermediary structure that reconciles the conflicting requirements of complete coverage for moisture protection and localized access for electrical connections. By strategically positioning openings or thin regions at conductive pad locations while maintaining full coverage elsewhere, the protective layers mediate between environmental protection and electrical connectivity needs.
Data Source
AI summary
A manufacturing method of an integrated circuit structure includes the following steps. A conductive layer is formed over a semiconductor substrate. A passivation layer is formed over the conductive layer, wherein the passivation layer partially covers the conductive layer. A first protective layer is formed over the passivation layer, wherein the first protective layer reveals a periphery of the passivation layer. A second protective layer is formed over the first protective layer, wherein the second protective layer covers the first protective layer and a part of the periphery of the passivation layer