Randomized IC Individualization via Molded Deformable Layer

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Solution Overview

Problem

Existing methods for individualizing integrated circuits are sensitive to environmental variations and aging, leading to reduced robustness and the potential misidentification of legitimate circuits as counterfeit.

Innovation Solution

A method is developed to create a unique individualization zone on integrated circuits by forming random patterns in a deformable layer using a mold with randomly collapsed reliefs, which are then transferred and filled with conductive material to create random short-circuits between vias, resulting in a unique and stable response.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If existing individualization methods exploit functional variations of integrated circuits, then unique identification is achieved, but sensitivity to environmental variations and aging reduces robustness

Engineering Contradiction:

ImproverobustnessVSAvoidenvironmental variations sensitivity

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

Instead of using functional variations that are sensitive to environmental changes, the invention inverts the approach by intentionally creating structural defects (short circuits) in the interconnection level. These defects create a unique physical fingerprint that is stable over time and insensitive to environmental variations, thereby resolving the contradiction between unique identification and environmental sensitivity

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The invention converts the harmful effect of environmental sensitivity into a benefit by creating a manufacturing process where random defects (short circuits) are intentionally introduced. These defects, which would normally be considered failures, become the basis for unique identification. The random nature of defect formation provides uniqueness while the physical structure provides stability against environmental variations

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Reliability

If random patterns are created in deformable layer using collapsed mold reliefs, then unique stable fingerprint is generated, but manufacturing process complexity increases

Engineering Contradiction:

Improveresponse stabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The mold reliefs automatically collapse in a random manner during the printing process onto the deformable layer, without requiring additional control mechanisms or complex equipment. This self-service approach to creating random patterns simplifies the manufacturing process while achieving the desired unique stable fingerprint

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The mold reliefs are pre-formed with specific geometric characteristics (high aspect ratio) that predispose them to collapse during the printing process. This preliminary preparation ensures that the random pattern formation occurs naturally as part of the standard manufacturing process, avoiding the need for additional complexity

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method produces a physically unclonable function (PUF) zone that is resistant to environmental changes and aging, providing a reliable and cost-effective means to uniquely identify each integrated circuit.

Implementation Method 1

deposit a deformable layer on the interconnection level, create, in an area of the deformable layer intended to include the individualization zone, patterns in relief, by penetrating a printing mold into the deformable layer

Methodology Applied

Scientific EffectElastic deformation: Elasticity

Implementation Method 2

fill the transferred random patterns with an electrically conductive material so as to form electrical connections between vias

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Data Source

PatentEP3889683B1Method for making a randomised zone of an integrated circuit

Publication Date: 2022.12.28 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Figure 1
Figure 2A~2B
Figure 3A~3D

AI summary

The invention relates to a method for creating an individualization zone (1) on an integrated circuit, the method comprising the following steps: • providing at least one first level (10A) of electrical traces (10), • depositing a dielectric layer (200) and a deformable layer (600) on the interconnection level, • creating, in a region of the deformable layer (600) intended to comprise the individualization zone (1), patterns, in relief, by penetrating an printing mold (1000) into the deformable layer (600), the creation of the patterns being configured so that the patterns exhibit a random character in the deformable layer (600), thus forming random patterns (610a) and that at least some random patterns (610a) extend over at least two vias (30) of the interconnection level,• transfer the random patterns (610a) into the dielectric layer (200) to form transferred random patterns (210) and expose the vias (30) located at the location of the transferred random patterns (210), • fill the transferred random patterns (210) with an electrically conductive material to form electrical connections between vias (30), • create a second level (20A) of electrical traces (20) on the vias (30) and the electrical connections.