Integrated Circuit Room Temperature Testing via Weighted DAC Outputs

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Solution Overview

Problem

Integrated circuits (ICs) require extensive testing across various temperatures to ensure operational reliability, which is time-consuming and costly, and existing methods do not efficiently determine the minimum performance characteristic at a specific temperature like room temperature.

Innovation Solution

The integration of multiple digital-to-analog converters (DACs) and processing circuitry to generate an output current that is weighted to ensure a minimum performance characteristic, such as current, occurs at a desired temperature (e.g., room temperature), allowing for reduced testing requirements by ensuring performance at colder or hotter temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If ICs are tested at multiple temperatures to ensure operational reliability, then reliability is improved, but loss of time and productivity deteriorate due to extensive testing requirements

Engineering Contradiction:
Improveoperational reliabilityVSAvoidtesting time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent applies parameter changes by modifying the performance characteristic parameter to have a minimum value at room temperature through weighted combination of multiple DAC outputs. This ensures that testing at room temperature (the parameter minimum) guarantees performance across the entire temperature range, thereby reducing testing time while maintaining reliability

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent implements preliminary action by designing the circuit to preemptively ensure minimum performance characteristics at room temperature through the weighted DAC combination during manufacturing. This preliminary design ensures that subsequent testing at a single temperature point is sufficient to guarantee operational reliability across all temperatures

Inventive Principle:
Principle #10Preliminary action

2Reliability

If ICs are tested at multiple temperatures to ensure operational reliability, then reliability is improved, but productivity deteriorates due to costly and time-consuming testing processes

Engineering Contradiction:
Improveoperational reliabilityVSAvoidtesting efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent changes the performance characteristic parameter to have its minimum value at room temperature through weighted DAC combination. This parameter transformation allows single-temperature testing to guarantee performance across the full temperature range, significantly improving testing efficiency while maintaining reliability standards

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent extracts the essential testing requirement from multiple temperature points to a single critical temperature point (room temperature) where the performance characteristic reaches its minimum. This extraction eliminates redundant testing at other temperatures while preserving reliability assurance

Inventive Principle:
Principle #2Taking out (Extraction)

3Manufacturing precision

If multiple DACs and processing circuitry are integrated to generate weighted output current, then manufacturing precision is improved to ensure minimum performance at desired temperature, but device complexity increases

Engineering Contradiction:
Improveminimum performance characteristic controlVSAvoidcircuit complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent segments the performance characteristic control into multiple independent DAC units, each handling a specific current component. This segmentation allows precise control of the weighted combination to ensure minimum performance at the desired temperature while maintaining modularity that manages circuit complexity

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS10120017B2Enabling testing of an integrated circuit at a single temperature
Publication Date: 2018.11.06 ALLEGRO MICROSYSTEMS LLC
  • US10120017B2 patent drawing
  • US10120017B2 patent drawing
  • US10120017B2 patent drawing

AI summary

In one aspect, an integrated circuit (IC) includes an output port enabling measurement of a performance characteristic of the IC at a first temperature. The performance characteristic of the IC is a minimum value at the first temperature with respect to any other temperature. The first temperature may be room temperature.