IC Package Segmented Paddle for Flexible Power Connections
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Solution Overview
Problem
Existing integrated circuit packages face challenges in providing multiple power and ground connections that are non-restrictive in physical placement, while simplifying wiring design rules and improving circuitry performance, without increasing package height or compromising manufacturing efficiency.
Innovation Solution
The solution involves forming a top paddle with dimensions smaller than the integrated circuit die, with leads and connectors arranged in different paths to minimize overlap and congestion, allowing for flexible placement of power and ground connections, and encapsulating these components to create a compact and efficient package structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional lead frame structures are used with a single large paddle, then manufacturing is simplified, but the ability to provide multiple power and ground connections with flexible physical placement is restricted
Solution Approach 1:
The single paddle is divided into multiple separate paddles (first paddle, second paddle, third paddle, fourth paddle) that can be independently positioned and connected to the integrated circuit die. This segmentation enables flexible placement of power and ground connections at different locations on the die without requiring a single large paddle, thus improving adaptability while managing complexity through modular design
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement by positioning paddles at different heights and locations around the integrated circuit die. The first and second paddles are positioned at a first height while the third and fourth paddles are positioned at a second height, creating vertical separation that allows flexible connection paths and improves adaptability for multiple power and ground connections
2Quantity of substance
If additional power and ground connections are added to meet high performance circuitry needs, then power management and performance improve, but routing congestion and wiring design complexity increase
Solution Approach 1:
Multiple separate paddles are used instead of a single paddle to provide numerous power and ground connections. Each paddle can be independently connected to different locations on the integrated circuit die, enabling high quantities of power and ground connections without creating routing congestion, as the connections are distributed across multiple discrete elements rather than requiring complex wiring paths
Solution Approach 2:
The paddles serve as intermediary elements between the integrated circuit die and the external circuit board. By using multiple paddles as intermediaries, the patent simplifies the wiring design rules because each paddle provides a direct connection path, eliminating the need for complex internal routing within a single paddle structure
3Length of stationary object
If package height is reduced for compact design, then space efficiency improves, but manufacturing precision requirements increase
Solution Approach 1:
The use of multiple discrete paddles allows for compact vertical stacking arrangement. By segmenting the connection structure into separate paddles that can be stacked at different heights, the overall package height is reduced while maintaining adequate spacing for connector attachment, thus improving space efficiency without excessively increasing precision requirements
Data Source
AI summary
An integrated circuit package system comprising: providing an integrated circuit die; forming a top paddle over the integrated circuit die wherein the top paddle has planar dimensions smaller than planar dimensions of the integrated circuit die; forming leads adjacent the top paddle; attaching first connectors to the integrated circuit die and the top paddle; attaching second connectors to the integrated circuit die and the leads; and forming an encapsulant over the first connectors, the second connectors, the integrated circuit die, and the top paddle.