IC Thermal Monitoring via Sensor Calibration

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Solution Overview

Problem

Integrated circuits, particularly field programmable gate arrays (FPGAs), face challenges in accurately identifying the hottest spots due to temperature sensor inaccuracies and varying environmental conditions, leading to increased power consumption from excessive thermal guard bands to maintain temperature limits.

Innovation Solution

The solution involves calibrating temperature sensors during manufacturing to account for errors and offsets, allowing for precise identification of the hottest locations and using a margin temperature to control cooling, reducing the thermal guard band from 5°C to 1°C, thereby optimizing fan control and power usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If temperature sensors are used to monitor integrated circuit temperature, then temperature measurement is enabled, but measurement precision deteriorates due to sensor inaccuracies and offsets

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidtemperature reading accuracy
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

Temperature sensors are calibrated during the manufacturing process to determine their specific offset values before the IC is deployed. This preliminary calibration stores correction data that compensates for sensor inaccuracies during actual operation, resolving the contradiction between enabling temperature monitoring and maintaining measurement accuracy.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent applies parameter changes by adjusting temperature readings through calibration offsets. The raw temperature sensor readings are modified by adding or subtracting calibrated offset values to produce corrected temperature measurements, thereby improving measurement precision while maintaining system reliability.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If thermal guard band is increased to ensure temperature limits are met, then reliability improves, but power consumption increases due to excessive cooling

Engineering Contradiction:
Improvetemperature limit complianceVSAvoidcooling power consumption
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

The system uses calibrated temperature sensor readings as feedback to dynamically control cooling. By providing accurate temperature information through calibration, the system can adjust cooling intensity to match actual thermal conditions, ensuring temperature limits are met while minimizing unnecessary cooling power consumption.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The patent changes the parameter of temperature measurement accuracy through calibration, enabling more precise thermal management. This allows the system to reduce the thermal guard band from 5°C to 1°C, optimizing the balance between reliability and power consumption by applying cooling only when truly necessary.

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If multiple temperature sensors are deployed to cover all hot spots, then measurement coverage improves, but device complexity increases

Engineering Contradiction:
Improvetemperature monitoring coverageVSAvoidsensor quantity and calibration complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent applies local quality by placing temperature sensors at specific strategic locations within the IC rather than uniformly distributing them. Each sensor is calibrated for its specific location's thermal characteristics, enabling accurate hot spot detection with fewer sensors and reducing device complexity while maintaining measurement precision.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables more accurate temperature control, reduces power consumption by minimizing the thermal guard band, and simplifies fan control by providing a single temperature margin value, ensuring the FPGA operates within specified temperature limits while minimizing energy use.

Implementation Method 1

receive a measurement of a first temperature in a circuit design for the integrated circuit from a temperature sensor

Methodology Applied
Scientific EffectTemperature sensing: Thermocouple

Data Source

PatentUS20240027279A1Systems And Methods For Thermal Monitoring In Integrated Circuits
Publication Date: 2024.01.25 ALTERA CORP
  • US20240027279A1 patent drawing
  • US20240027279A1 patent drawing
  • US20240027279A1 patent drawing

AI summary

A method is provided for thermally monitoring an integrated circuit during operation of the integrated circuit. The method includes receiving a measurement of a temperature in a circuit design for the integrated circuit from a temperature sensor, and determining a hottest temperature in the circuit design based on the measurement of the temperature. A non-transitory computer readable storage medium includes computer readable instructions stored thereon for causing a computing system to receive a measurement of a first temperature in a circuit design for an integrated circuit from a temperature sensor, and determine a second temperature of a cold spot in an active region of the circuit design by adjusting the measurement of the first temperature generated by the temperature sensor by an offset.